PART |
Description |
Maker |
SOT-227 MSS50-800 MSS50-1200 MSS40-1200 MSS40-800 |
BACK TO BACK SCR MODULE
|
Comset Semiconductor
|
S10202-08 S10202-16 S10201-04 |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. 回到清淡TDI发动机,防治荒漠化工作的后台薄TDI的模式在防治荒漠化公约提供高灵敏度
|
Hamamatsu Photonics K.K.
|
S10202-16 S10202-08 S10201-04 S10200-02 |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
|
Hamamatsu Corporation
|
K-05205GX K-04211GX-P K-05205GX-P |
LCD back light, COB type, LCD character 16x4, yellow/green LCD back light, COB type, LCD character 20x2, yellow/green LCD BACK LIGHT, COB TYPE, LCD CHARACTER 20 X 2, 16 X 4
|
PARA Light List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
|
L-02401G-B5 |
BACK LIGHT
|
LIGITEK electronics co....
|
6411 |
Back Probe Pin
|
Pomona Electronics
|
NEDZP105Z5V85X24AF NEDZP105Z5V85X24BF NEDZP155Z5V8 |
Power Back-Up Capacitors
|
NIC-Components Corp.
|
HT8665 |
Talking Back with Echo
|
Holtek Semiconductor In... HOLTEK[Holtek Semiconductor Inc]
|
SS-300R8P |
One of passive Back plane.
|
List of Unclassifed Man...
|
6544 |
Rigid Back Probe Pin
|
Pomona Electronics
|
HBO0403E-62 |
Back Electret Condenser Microphone
|
JL World Company Limited.
|
IXFR38N80Q2 |
Electrically Isolated Back Surface
|
IXYS[IXYS Corporation]
|