PART |
Description |
Maker |
90-0096 |
PACKAGE LAND PATTERN, (S8) 0.150 SOIC, 8 LEADS
|
Maxim Integrated Products
|
90-0167 |
PACKAGE LAND PATTERN, (E16) 0.150 QSOP, 16 LEADS
|
Maxim Integrated Products
|
90-0150 |
PACKAGE LAND PATTERN, (S8E-12 / S8E 12)
|
Maxim Integrated Products
|
90-0058 |
PACKAGE LAND PATTERN, (T633-2 / T633 2)
|
Maxim Integrated Products
|
90-0002 |
PACKAGE LAND PATTERN, (T4055-2 / T4055 2)
|
Maxim Integrated Products
|
90-0035 |
PACKAGE LAND PATTERN, (T2844-1 / T2844 1)
|
Maxim Integrated Products
|
90-0120 |
PACKAGE LAND PATTERN, (U16E-3 / U16E 3)
|
Maxim Integrated Products
|
90-0082 |
PACKAGE LAND PATTERN, (T1032N-1 / T1032N 1)
|
Maxim Integrated Products
|
LPF2807T-100M-C LPF2807T-2R2M-C LPF2807T-3R3M-C LP |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
LPF3010 LPF3010T-3R3M LPF3010T-6R8M LPF3010T-470M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
LPN5845T-151K |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|