| PART |
Description |
Maker |
| 21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
|
| 90-0092 |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
|
Maxim Integrated Products
|
| MAX552AEPA MAX552AEUB MAX551/MAX552 |
12-Bit Digital-to-Analog Converter
3V/ 5V 12-Bit Serial Multiplying DACs in 10-Pin uMAX Package
|
Maxim Integrated Products, Inc.
|
| SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| WQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN7X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
