PART |
Description |
Maker |
21-0061 |
PACKAGE OUTLINE, 10L UMAX/USOP
|
Maxim Integrated Products
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
SOT684-2 |
Package outline
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3.8X6.2-44 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP3X4-12 |
Package Outline
|
Global Mixed-mode Techn...
|
TO220 |
Package Outline
|
Global Mixed-mode Techn...
|
SC70-4 |
Package Outline
|
Global Mixed-mode Techn...
|