| PART |
Description |
Maker |
| 121-27296-04-260 121-27296-2 121-27296-4 121-27296 |
POWER TERMINAL WITH INSULATOR 125 x 250 GRID - 6PIN
POWER TERMINAL WITH INSULATOR .125 X .250 GRID - 6 PIN
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Winchester Electronics Corporation
Winchester Electronics ...
|
| A-7859-2561 7859-2561N 15-29-1026 0015291026 |
2.54mm (.100) Pitch C-Grid? Shunt Terminal Housings, (30μ) Gold (Au), 2 Circuits, with Pin Stop
2.54mm (.100") Pitch C-Grid庐 Shunt Terminal Housings, (30渭") Gold (Au), 2 Circuits, with Pin Stop
2.54mm (.100") Pitch C-Grid垄莽 Shunt Terminal Housings, (30楼矛") Gold (Au), 2 Circuits, with Pin Stop
|
Molex Electronics Ltd.
|
| SFRC9130S.5B |
10 AMP /100 Volts 300 mRadiation Tolerant P-Channel MOSFET 10 A, 100 V, 0.3 ohm, P-CHANNEL, Si, POWER, MOSFET
|
Solid States Devices, Inc.
Solid State Devices, Inc.
|
| APT30M40LVFR APT30M40B2VFR APT30M40B2VFRG |
Power FREDFET; Package: T-MAX™ [B2]; ID (A): 76; RDS(on) (Ohms): 0.04; BVDSS (V): 300; 76 A, 300 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET
POWER MOS V FREDFET
|
Microsemi, Corp.
ADPOW[Advanced Power Technology]
|
| 87664-2001 0876642001 |
6.35mm (.250) and 7.62mm (.300) Pitch Power, 2.54mm (.100) Pitch Signal,EXTreme PowerPlus AC/DC Receptacle, Through Hole, Right Angle,33 Circuits,
6.35mm (.250") and 7.62mm (.300") Pitch Power, 2.54mm (.100") Pitch Signal,EXTreme PowerPlus垄芒 AC/DC Receptacle, Through Hole, Right Angle,33 Circuits,
|
Molex Electronics Ltd.
|
| 87664-2004 0876642004 |
6.35mm (.250) and 7.62mm (.300) Pitch Power, 2.54mm (.100) Pitch Signal, EXTreme PowerPlus AC/DC Receptacle, Through Hole, Right Angle,31 Circuits
6.35mm (.250") and 7.62mm (.300") Pitch Power, 2.54mm (.100") Pitch Signal, EXTreme PowerPlus垄芒 AC/DC Receptacle, Through Hole, Right Angle,31 Circuits
|
Molex Electronics Ltd.
|
| FSL913A0D FSL913A0D1 FSL913A0D3 FSL913A0R FSL913A0 |
7A, -100V, 0.300 Ohm, Rad Hard, SEGR Resistant, P-Channel Power MOSFETs 7 A, 100 V, 0.3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-205AF
7A, -100V, 0.300 Ohm, Rad Hard, SEGR Resistant, P-Channel Power MOSFETs 7A 100V的，0.300欧姆，拉德硬，SEGR性，P通道功率MOSFET
7A/ -100V/ 0.300 Ohm/ Rad Hard/ SEGR Resistant/ P-Channel Power MOSFETs
5A/ -100V/ 0.680 Ohm/ Rad Hard/ SEGR Resistant/ P-Channel Power MOSFETs
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
| 90121-0132 90121-0145 90121-0123 90121-0960 90121- |
Header; Number of Contacts:12; Pitch Spacing:2.54mm; Number of Rows:1; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Right Angle Pin 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
C-Grid SR RA Pn 6.75/2.90mm Tn-A 25Ckt 25 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
CONN HEADER 3POS .100 R/A TIN 3 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
C-Grid SR RA Pn 6.75/2.90mm Au-F 40Ckt 40 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
Header; Number of Contacts:5; Pitch Spacing:2.54mm; Number of Rows:1; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Right Angle Pin 5 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
C-Grid SR RA Pn 6.75/2.90mm Au-F 8Ckt 8 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
C-Grid SR RA Pn 6.75/2.90mm Au-F 15Ckt 15 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
C-Grid SR RA Pn 6.75/2.90mm Au-F 4Ckt 4 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
Header; Number of Contacts:10; Pitch Spacing:2.54mm; Number of Rows:1; Series:C-Grid III; Connector Body Material:Polyester; Mounting Type:PC Board; Terminal Type:Right Angle Pin
|
Molex, Inc.
MOLEX INC
|
| 87663-9005 |
6.35mm (.250) Pitch Power (DC), 7.62mm (.300) Pitch Power (AC), 2.54mm (.100) Pitch Signal
|
Molex Electronics Ltd.
|
| M3V-50 M3H-50 |
Three-Way Power Dividers 1 - 100 MHz and 50 - 300 MHz
|
http://
MACOM[Tyco Electronics]
|
| PL342 PL34120191000GDDC PL34120191000KKEX PL341201 |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
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Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
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