| PART |
Description |
Maker |
| BM-20EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG88ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BD-A404ND |
hi-eff red chips, GaAsP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BA-3E12UW |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-E544RE |
hi-eff red chips, which are made from GaAsP on GaP substrate
|
BRIGHT LED ELECTRONICS CORP
|
| BD-F304RD |
800mA Buck Converter for 3G RFPAs, WL-CSP-12, Tape & Reel
hi-eff red chips, which are made from GaAsP on GaP substrate.
|
Bright LED Electronics Corp.
|
| PL16-CTR12 |
5MM T1? Hi-Eff Red LED
|
P-tec Corporation
|
| BL-HE135A-TRB |
Hi-Eff Red Suitable for all SMT assembly methods.
|
Bright LED Electronics Corp.
|
| PL008-WCR12 |
SMD LED PLCC-2 Package Hi-Eff Red
|
P-tec Corporation
|
| BL-HE1G034B-TRB |
Hi-Eff Red and Suitable for all SMT assembly methods.
|
Bright LED Electronics Corp.
|
