| PART |
Description |
Maker |
| HI1-774J5 HI3-674ALD5 HI3-674ATD/883 HI1-774AK5 HI |
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 536-0525-5 91; Contact Mating Area Plating: Gold
Converter IC 转换IC
Converter IC 转换器IC
|
Rochester Electronics, LLC
Intersil, Corp.
|
| DS1280 |
3-Wire to Bytewide Converter Chip(3线至字节宽度位）转换芯片)
3-Wire to Bytewide Converter Chip(3绾胯?瀛??瀹藉害锛?浣??杞?????)
|
Maxim Integrated Products, Inc.
|
| WAP-6150 |
300Mbps Compatible with IEEE 802.11b/g/n wireless standards Multi-operation modes to suit different wireless applications
|
Level One
|
| M64886FP REJ03F0087-0100Z |
ASSP>Short-Range Wireless Communication>Short-Range Wireless Communication ICs
RF Transceiver for Short-range Wireless
From old datasheet system
|
RENESAS[Renesas Electronics Corporation]
|
| DS2450S |
1-Wire Quad A/D Converter
|
MAXIM - Dallas Semiconductor
|
| DS2450 |
1-Wire Quad A/D Converter
|
MAXIM - Dallas Semiconductor
|
| MC13181 MC13181R2 |
Wireless Power Management Integrated Circuit
MC13181 Technical Data Sheet: Wireless Power Managment Integrated Circuit
|
http://
Motorola, Inc
|
| AD5337ARMZ-REEL7 AD5337ARMZ |
2.5 V to 5.5 V 250 µA 2-Wire Interface Dual Voltage Output 8-Bit D/A Converter
|
Analog Devices
|
| 51111-1100 0511111100 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, WithRetainer, 11 Circuits
|
Molex Electronics Ltd.
|
| 51111-0810 0511110810 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, withoutRetainer, 8 Circuits
|
Molex Electronics Ltd.
|
| 0510210700 51021-0700 |
1.25mm (.049) Pitch PicoBlade Wire-to-Wire and Wire-to-Board Housing, Female, 7Circuits
|
Molex Electronics Ltd.
|
| 0511110400 51111-0400 |
2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Receptacle Housing, WithRetainer, 4 Circuits
|
Molex Electronics Ltd.
|
