PART |
Description |
Maker |
NANDA9R3N1AZBC5E NANDA9R3N1BZBC5F NANDA9R3N1CZBC5F |
SPECIALTY MEMORY CIRCUIT, PBGA137 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-137 SPECIALTY MEMORY CIRCUIT, PBGA152
|
Numonyx Asia Pacific Pte, Ltd.
|
IDT79R2020A12G IDT79R2020A12JB |
SPECIALTY MEMORY CIRCUIT, CPGA68 SPECIALTY MEMORY CIRCUIT, PQCC68
|
INTEGRATED DEVICE TECHNOLOGY INC
|
CY8C20140-LDX2I CY8C20142-SX1I CY8C20110-LDX2I CY8 |
Input/Output (I/O); Supply Voltage: 2.4V to 5.5V; Temperature Range: -40° to 85°C; Package: 16-QFN (16-COL); Features: 4 Configurable I/Os SPECIALTY MEMORY CIRCUIT, QCC16 Input/Output (I/O); Supply Voltage: 2.4V to 5.25V; Temperature Range: -40° to 85°C; Package: 8-SOIC; Features: 4 Configurable I/Os SPECIALTY MEMORY CIRCUIT, PDSO8 CapSenseLITE - 10 Configurable IOs SPECIALTY MEMORY CIRCUIT, QCC16
|
Cypress Semiconductor, Corp. CYPRESS SEMICONDUCTOR CORP
|
K5A3280YBC-T855 K5A3380YBC-T855 K5A3280YTC-T855 K5 |
SPECIALTY MEMORY CIRCUIT, PBGA69 8 X 11 MM, 0.80 MM PITCH, 1.20 MM HEIGHT, TBGA-69 MCP MEMORY
|
http:// Fujitsu, Ltd. SAMSUNG SEMICONDUCTOR CO. LTD.
|
DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC ADVANCED MICRO DEVICES INC
|
AM75PDL193CHH70I AM75PDL191CHH70I AM75PDL191CHH040 |
128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion Inc. Spansion, Inc.
|
RD28F3208C3T70 RD28F3208C3B90 |
TVS BIDIRECT 400W 90V SMA 3 VOLT INTEL Advanced BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye SPECIALTY MEMORY CIRCUIT, PBGA66
|
INTEL CORP Intel, Corp.
|
M36L0T7060B2ZAQF |
SPECIALTY MEMORY CIRCUIT, PBGA88
|
STMICROELECTRONICS
|
AT88SC0204C-MP AT88SC0204C-MPTG AT88SC0204C-MJ AT8 |
SPECIALTY MEMORY CIRCUIT, XMA8
|
聚兴科技股份有限公司 ATMEL CORP
|