| PART |
Description |
Maker |
| 335-AD10-G5P 335-AA10-G5P |
Non-Contact Ultrasonic Transmitter For Level, Volume, and Open Channel Flow Measurement
|
Magnetrol International, Inc.
|
| 384-2K00-003 301-R010-400 300-R010-45G |
Echotel? Model 300/301 Ultrasonic Non-Contact Transmitter For Level/Volume/Open Channel Flow
|
Magnetrol International, Inc.
|
| 384-2K00-003 345-0442-102 344-0442-101 |
Echotel? Models 344/345 Ultrasonic Non-Contact Transmitters for Level, Volume, or Open Channel Flow
|
Magnetrol International, Inc.
|
| 300-R010-45L 300-R01C-45L |
Echotel? Model 300/301 Ultrasonic Non-Contact Transmitter For Level, Volume, and Open Channel Flow
|
Magnetrol International, Inc.
|
| 17572 17572-G |
HTSNK. B X-FLOW. .9H LOW FLOW. THRU HOLE HTSNKB型X流0.9 低流量。通孔
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| CY7C1475V33-133BGXI CY7C1475V33-133BGI CY7C1475V33 |
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLArchitecture 4M X 18 ZBT SRAM, 8.5 ns, PBGA165
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLArchitecture 4M X 18 ZBT SRAM, 6.5 ns, PQFP100
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture(带NoBL结构B>72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM)
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL?/a> Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL垄芒 Architecture
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
|
| EM800-DCM40 EM800DCM40 |
LambdaDriver?- LambdaDriver ?Dispersion Compensation Modules (DCM)
|
MRV Communications, Inc.
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| KF3004-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| 1LWP2300 5TH21000 5TH23000 |
THERMAL Pads For SC, SV and SO relays Low thermal resistance Easy to use
|
celduc-relais
|
| KD2002-DC72A |
Thick film thermal printhead(with thermal historical control)
|
Rohm
|
