| PART |
Description |
Maker |
| AM29DL162DT120WCE AM29DL162DT120WCEN AM29DL163DB12 |
400V Single N-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6792 with Standard Packaging
x8/x16 Flash EEPROM
100V Single N-Channel Hi-Rel MOSFET in a TO-205AF package; A IRLF120 with Standard Packaging
500V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF460 with Standard Packaging
400V Single N-Channel Hi-Rel MOSFET in a TO-205AF package; A IRFF310 with Standard Packaging
100V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY140CM with Standard Packaging
60V Single N-Channel Hi-Rel MOSFET in a D3 package; A IRFMJ044 with Standard Packaging
-100V Single P-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY9140CM with Standard Packaging x8/x16闪存EEPROM
55V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRF5YZ48CM with Standard Packaging x8/x16闪存EEPROM
400V Single N-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6786 with Standard Packaging EEPROM
-100V Single P-Channel Hi-Rel MOSFET in a TO-257AA package; A IRF5Y9540CM with Standard Packaging x8/x16闪存EEPROM
-100V Single P-Channel Hi-Rel MOSFET in a TO-204AA package; A IRF9130 with Standard Packaging x8/x16闪存EEPROM
100V Single N-Channel Hi-Rel MOSFET in a 18-pin LCC package; A JANTX2N6782U with Standard Packaging x8/x16闪存EEPROM
1000V Single N-Channel Hi-Rel MOSFET in a TO-204AA package; A IRFAG40 with Standard Packaging EEPROM
|
PLX Technology, Inc.
|
| AM29845AJC AM29845A/BLA AM29845ADMB AM29845APC AM2 |
600V UltraFast 8-25 kHz Discrete IGBT in a TO-220AB package; A IRG4BC30K with Standard Packaging
1200V UltraFast 4-20 kHz Discrete IGBT in a TO-247AC package; A IRG4PH50K with Standard Packaging
600V UltraFast 8-60 kHz Discrete IGBT in a TO-247AC package; A IRG4PC40U with Standard Packaging
600V UltraFast 8-25 kHz Discrete IGBT in a TO-247AC package; Similar to IRG4PC40K with Lead Free Packaging
1200V UltraFast 8-25 kHz Single IGBT in a TO-274AA package; A IRGPS40B120U with Standard Packaging
600V UltraFast 8-60 kHz Discrete IGBT in a TO-247AC package; A IRG4PC50U with Standard Packaging
1200V UltraFast 8-40 kHz Discrete IGBT in a TO-274AA package; A IRG4PSH71U with Standard Packaging
1200V UltraFast 4-20 kHz Discrete IGBT in a D2-Pak package; A IRG4BH20K-S with Standard Packaging
600V Fast 1-8 kHz Discrete IGBT in a TO-247AC package; A IRG4PC50F with Standard Packaging
1200V UltraFast 5-40 kHz Discrete IGBT in a TO-247AC package; A IRG4PH50U with Standard Packaging
10-Bit D-Type Latch
600V Warp 60-150 kHz Discrete IGBT in a TO-262 package; A IRG4BC40WL with Standard Packaging 8位D型锁存器
8-Bit D-Type Latch 8位D型锁存器
|
Bourns, Inc.
|
| PST9346U PST9319U PST9342U PST9339U PST9338U PST93 |
-40V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7241 with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR9024NCPBF with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF9Z24NS with Standard Packaging
-20V Single P-Channel HEXFET Power MOSFET in a Micro 3 package; A IRLML6402 with Tape and Reel Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF5305 with Standard Packaging
Voltage Detector 电压检测器
-12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7220 with Standard Packaging 电压检测器
-30V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7406 with Standard Packaging
-100V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU9120N with Standard Packaging
|
Maxim Integrated Products, Inc.
|
| DFN2626P10 |
ZXRD060 0.6V dual shunt regulator in DFN2626P10 packaging
|
Diodes Incorporated
|
| VRA2415ZP-6WR2 VRA2412ZP-6WR2 |
REGULATED DUAL/SINGLE OUTPUT DIP PACKAGING, DC-DC CONVERTER
|
MORNSUN Science& Techno...
|
| G7881-21 G7881-22 G7881-23 G7881-32 G7881-44 G8339 |
Supply voltage:0.3-5.5V; InGaAs PIN photodiode with preamp: receptacle type, 1.3/1.55um, 156, 622Mbps/1.25, 2.5Gbps. For optical fiber communications, fiber channel, gigabit enthernet, HDTV, SDH
Aluminum Snap-In Capacitor; Capacitance: 100uF; Voltage: 400V; Case Size: 20x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 6800uF; Voltage: 25V; Case Size: 25x25 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 400V; Case Size: 35x30 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 150uF; Voltage: 400V; Case Size: 20x40 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 680uF; Voltage: 400V; Case Size: 35x45 mm; Packaging: Bulk
Aluminum Snap-In Capacitor; Capacitance: 100uF; Voltage: 400V; Case Size: 22x25 mm; Packaging: Bulk 铟镓砷PIN光电二极管和前置放大
Aluminum Snap-In Capacitor; Capacitance: 390uF; Voltage: 400V; Case Size: 25x50 mm; Packaging: Bulk 铟镓砷PIN光电二极管和前置放大
Aluminum Snap-In Capacitor; Capacitance: 470uF; Voltage: 250V; Case Size: 30x25 mm; Packaging: Bulk 铟镓砷PIN光电二极管和前置放大
FIBER OPTIC RECEIVER, 1250Mbps, PANEL MOUNT, LC CONNECTOR
Aluminum Snap-In Capacitor; Capacitance: 68uF; Voltage: 400V; Case Size: 20x25 mm; Packaging: Bulk
|
HAMAMATSU[Hamamatsu Corporation]
Hamamatsu Photonics K.K.
|
| SGM4684XG_TR SGM4684 SGM4684XG/TR |
Chip Scale Packaging, Low-Voltage 0.4Ω, Dual, SPDT Analog Switch
Chip Scale Packaging, Low-Voltage 0.4ヘ, Dual, SPDT Analog Switch
|
Shengbang Microelectronics Co, Ltd
|
| PSX96B-133MQ160 PSX160-80PQ240 PSX160-66PQ240 PSX1 |
-55V Single P-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU9024NCPBF with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a TO-220 Full-Pak package; Similar to IRLIB9343 with Lead Free Packaging
User Programmable Special Function ASIC
-150V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF6217 with Standard Packaging
-30V P-Channel HEXFET Power MOSFET in a LeadFree SO-8 -package; A IRF7416QPBF with Standard Packaging
-20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; A IRF7425 with Standard Packaging
-20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7425 with Lead-Free Packaging.
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR9343 with Standard Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR9024N with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR5505 with Lead Free Packaging
-55V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR5305 with Lead Free Packaging 用户可编程ASIC的特殊功
-20V Single P-Channel HEXFET Power MOSFET in a 4-Lead FlipFET package; A IRF6100 with Standard Packaging 用户可编程ASIC的特殊功
-20V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7207 with Lead Free Packaging 用户可编程ASIC的特殊功
-55V Single P-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF4905S with Standard Packaging 用户可编程ASIC的特殊功
|
ITT, Corp.
Ironwood Electronics
|
| 0879143435 87914-3435 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143216 87914-3216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143016 87914-3016 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| AM29L516DC AM29L517DC AM29L517AXC AM29L517/BXC AM2 |
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21593S with Standard
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Tape
Dimming Ballast Control, Brown-out Protection, Programmable Preheat Time, 1.8us Deadtime in a 16-lead SOIC Narrow package; A IR21592S with Standard
Half Bridge Driver, LO In Phase with RT, Programmable Oscillating Frequency, 0.6us Deadtime in a 8-lead SOIC package and different phase; Similar to IR21531S with Lead Free Packaging
Hi-Rel DC-DC Standard Dual Converter in a ATR package; A ATR2815D with Standard Packaging
Ballast Control, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 14-pin DIP package; A IR2156 with Standard Packaging
Hi-Rel DC-DC Standard Triple Converter in a ATR package; A ATR2815T with Standard Packaging
Hi-Rel DC-DC Rad-Hard Triple Converter in a ART package; A ART2812T with Standard Packaging
600V Ballast Controller IC with Adaptive Zero-Voltage Switching, Internal Crest Factor Over-Current Protection and an Integrated Bootstrap Diode in a 8-Pin SOIC package.; Similar to IR2520DS with Lead Free Packaging
Multiplier 乘数
|
Rochester Electronics, LLC
|
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