| PART |
Description |
Maker |
| C3216X7S2A225MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C3225X7S2A335KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| CAK-001 CAK-001MF CAK-001AF CAK-2405F CAK-002AF CA |
TDK DC to DC Converters, DC to AC inverters
|
TDK[TDK Electronics]
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| ACM2520-102-2P-T002 |
EMC Engineering Section Magnetics Business Group TDK-EPC Corporation
|
TDK Electronics
|
| 55PC1223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1811 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| ST16-19RFRDCS 7759 ST16 ST19-RFRDCS ST16-RFRDCS |
ST16-19RFRDCS CHIP SET INTERFACE SPECIFICATION
CHIP SET INTERFACE SPECIFICATION
From old datasheet system
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| ELC09D2R2F ELC09D100F ELC09D102F ELC09D2R3F ELC09D |
SPECIFICATION CHOKE COIL
This specification covers the CHOKE COIL
|
List of Unclassifed Manufacturers
|
| SPM0204LE5H-QB |
Halogen Free Enhanced RF Protected Zero Height Mini隆卤 SiSonic垄芒 Microphone Specification
Halogen Free Enhanced RF Protected Zero Height Mini SiSonic Microphone Specification
|
Knowles Electronics
|
