| PART |
Description |
Maker |
| M6MGT331S4BKT M6MGB331S4BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| EDI9LC644V1312BC EDI9LC644V1310BC EDI9LC644V1512BC |
SSRAM access:133MHz; SDRAM access:125MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:133MHz; SDRAM access:100MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:150MHz; SDRAM access:125MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:200MHz; SDRAM access:100MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:166MHz; SDRAM access:125MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:150MHz; SDRAM access:100MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:166MHz; SDRAM access:100MHz; 128K x 32 SSRAM/1M x 32 SDRAM
SSRAM access:200MHz; SDRAM access:125MHz; 128K x 32 SSRAM/1M x 32 SDRAM
|
White Electronic Designs
|
| EDI9LC644V EDI9LC644AV2010BC EDI9LC644AV1512BC EDI |
128Kx32 SSRAM/1Mx32 SDRAM Array(3.3V,128x32同步静态RAMB>1Mx32同步动态RAM阵列)
128Kx32 SSRAM/1Mx32 SDRAM Array(3.3V,128x32同步静态RAMMx32同步动态RAM阵列)
SPECIALTY MEMORY CIRCUIT, PBGA153
|
White Electronic Designs Corporation
|
| AM49DL640BG25IS AM49DL640BG25IT AM49DL640BG35IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Spansion, Inc.
Spansion Inc.
Advanced Micro Devices
|
| S71WS-NX0 S71WS512ND0BFWA23 S71WS512NC0BFWA23 S71W |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
SPANSION LLC
|
| NBL15602S |
KEMET, NBL, Transducers, Single-layer
|
Kemet Corporation
|
| WED2ZL64512S WED2ZL64512S35BC WED2ZL64512S38BC WED |
512K x 64 Synchronous Pipeline NBL SRAM
|
White Electronic Designs Corporation
|
| AS5SS256K36ADQ-8.5XT AS5SS256K36ADQ-10IT AS5SS256K |
256K x 36 SSRAM - synchronous burst SRAM, flow-thru
|
Austin Semiconductor
|
| AS5SS256K36ADQ-10_883C AS5SS256K36ADQ-10_IT AS5SS2 |
256K x 36 SSRAM Flow-Through, Synchronous Burst SRAM
|
Austin Semiconductor
http://
|
| AS5SS256K18DQ-10_IT AS5SS256K18DQ-10_XT AS5SS256K1 |
256K x 18 SSRAM Synchronous Burst SRAM, Flow-Through
|
Austin Semiconductor
|
| F4655-1305 |
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 μm Channel Diameter
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 レm Channel Diameter
|
Hamamatsu Corporation
|
| DS42587 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
