| PART |
Description |
Maker |
| 0951-A4ITEM3 0951-A4ITEM1 0951-A4ITEM2 |
MASSEVERBINDUNG VERZINNT 15QMM 250MM
MASSEVERBINDUNG VERZINNT 10QMM 150MM MASSEVERBINDUNG VERZINNT 10QMM 150毫米
MASSEVERBINDUNG VERZINNT 25QMM 400MM MASSEVERBINDUNG VERZINNT 25QMM 400毫米
|
飞思卡尔半导体(中国)有限公司
|
| M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM17AWG M6MGT64BM17AWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| PPU10/8BLACK PPU10/8BLUE PPU4/2.5BLACK PPU4/2.5BLU |
SCHLAUCH POLYURETHAN 10MM SCHW 30MROLLE
SCHLAUCH POLYURETHAN 10MM BLAU 30MROLLE
SCHLAUCH POLYURETHAN 4MM SCHW 30MROLLE
SCHLAUCH POLYURETHAN 4MM BLAU 30MROLLE
SCHLAUCH POLYURETHAN 6MM SCHW 30MROLLE
SCHLAUCH POLYURETHAN 6MM NATUR 30MROLLE
SCHLAUCH POLYURETHAN 8MM NATUR 30MROLLE
SCHLAUCH POLYURETHAN 4MM GELB 30MROLLE
SCHLAUCH POLYURETHAN 8MM SCHW 30MROLLE 施劳赫聚氨酯8毫米嘉信30MROLLE
|
Omron Electronics, LLC
|
| M6MGD13TW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
|
Renesas Electronics Corporation
|
| BRCB032GWZ-3E2 |
WL-CSP EEPROM
|
ROHM
|
| BU9889GUL-WE2 |
WL-CSP EEPROM
|
ROHM
|
| BRCB016GWL-3 BRCB016GWL-3E2 |
WL-CSP EEPROM
|
ROHM
|
| BRCG064GWZ-3 |
WL-CSP EEPROM
|
ROHM
|
| BRCE064GWZ-3 BRCE064GWZ-3E2 |
WL-CSP EEPROM
|
ROHM
|
| CM1204-03CP |
4-Channel ESD Array in CSP
|
ON Semiconductor
|
| FDZ191P |
P-Channel 1.5V PowerTrench WL-CSP MOSFET
|
FAIRCHILD[Fairchild Semiconductor]
|
