| PART |
Description |
Maker |
| DS42514 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
From old datasheet system
|
AMD[Advanced Micro Devices]
|
| DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| DS42587 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| M6MGT331S8BKT M6MGB331S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| WS512K16-XDLX WS512K16-17 |
SRAM MCP
512Kx16 SRAM Module(512Kx16静态RAM模块（存取时7ns
|
White Electronic Designs Corporation
|
| AM50DL128BH56I AM50DL128BH70I AM50DL128BH70IS |
Circular Connector; No. of Contacts:56; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
|
| AM50DL128BH85IS AM50DL128BH85I AM50DL128BH AM50DL1 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AM45DL3208GT70IS AM45DL3208GT85IS AM45DL3208GT70IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| MC-222273F9-B85X-BT3 MC-222273-X |
MCP(32M-bit flash memory 8M-bit Low Power SRAM)
|
NEC
|
