| PART |
Description |
Maker |
| HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics
Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers
ETC[ETC]
Hantronix,Inc
Electronic Theatre Controls, Inc.
|
| NHD-C12864GG-RN-GBW |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display International, Inc.
|
| NHD-C0220AU-FSW-FTS |
COG (Chip┸on┸Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| HDG12864F-1 |
Chip On Glass Technology
|
Hantronix,Inc
|
| THM361020S-10 THM361020S-80 THM361020SG-10 THM3610 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
1048576 WORDS x 36 BIT DYNAMIC RAM MODULE
1,048,576 WORDS x 36 BIT DYNAMIC RAM MODULE
1/048/576 WORDS x 36 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| THM362020S-10 THM362020S-80 THM362020SG-10 THM3620 |
2097152 WORDS x 36BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 36BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 36BIT DYNAMIC RAM MODULE
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
|
TOSHIBA[Toshiba Semiconductor]
Toshiba Corporation
|
| THM321020S-10 THM321020S-80 THM321020SG-10 THM3210 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
1048576 WORDS x 32 BIT DYNAMIC RAM MODULE
1,048,576 WORDS x 32 BIT DYNAMIC RAM MODULE
1/048/576 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| SIGC144T170R2C SIGC144T170R2C09 |
IGBT Chip in NPT-technology 1700V NPT technology 280 μm chip
|
Infineon Technologies AG
|
| SIGC07T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| CAT24C00JITE13 CAT24C00LETE13 CAT24C00LITE13 CAT24 |
320 x 240 pixel format, Chip-On-Glass Technology
CONNECTOR ACCESSORY
From old datasheet system
128-bit Serial EEPROM
128-bit, 100 kHz @ 1.8 V & 400 kHz @ 5.0 V, 5-pin SOT23 Package
|
Catalyst Semiconductor
|
| BC75-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
