| PART |
Description |
Maker |
| M6MGT331S8BKT M6MGB331S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装（MCP）闪存和SRAM
|
Advanced Micro Devices, Inc.
Spansion, Inc.
|
| DS42546 AM29DL163D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
From old datasheet system
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| F4655-1305 |
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 μm Channel Diameter
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 レm Channel Diameter
|
Hamamatsu Corporation
|
| DS42553 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| HN58C1001 HN58C1001FP-15 HN58C1001FP-15E HN58C1001 |
Memory>EEPROM>Parallel EEPROM
1M EEPROM (128-kword 】 8-bit) Ready/Busy and RES function
|
Renesas Electronics Corporation
|
| BR25H010-2C |
Serial EEPROM Series Automotive EEPROM 125 Operation SPI BUS EEPROM
|
Rohm
|
| BR25H080FVM-2CE2 BR25H080FVM-2CTR |
Serial EEPROM Series Automotive EEPROM 125 Operation SPI BUS EEPROM
|
Rohm
|
