| PART |
Description |
Maker |
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV817 LTV827 LTV847 |
HIgh Density Mounting Type Photocoupler
|
TMT[Taiwan Memory Technology]
LITEON
|
| LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC817B PC817C PC827 PC-817 PC817A PC847 PC837 PC81 |
HIGH DENSITY MOUNTING TYPE PHOTOCOUPLER
|
Sharp Electrionic Compo...
SHARP[Sharp Electrionic Components]
Sharp Corporation
|
| PC815 PC815-SERIES |
High Sensitivity, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
光宝科技股份有限公司
|
| 5694F-A 5694F7 5694F1 5694F3 5694F5 |
High Density Right Angle Mounting T-1 LED Assembly
|
CML[Chicago Miniature Lamp,inc]
|
| HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| ISP521-1 ISP521-1X ISP521-108 ISP521-2 ISP521-2X I |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
