| PART |
Description |
Maker |
| PT493FE0000F |
Opaque Resin, Medium Directivity Angle, Long Terminal Darlington Phototransistor
|
Sharp Electrionic Components
|
| PT481E00000F |
Pale Blue Transparent Resin, Narrow Angle, Darlington Phototransistor
|
Sharp Electrionic Components
|
| AC05DSMA |
5A resin insulating TRIAC
5 A RESIN INSULATION TYPE TRIAC
|
NEC
|
| WAS-CLM-TSCS-P22 WAS-CLM_TSCS-P22 WAS-CLM/TSCS-P22 |
MATERIAL: BAKELITE XP OR EQUIVALENT OR OPAQUE MYLAR
|
Ferroxcube International Holding B.V.
|
| WAS-CLM-C-P14-8 WAS-CLM_C-P14_8 WAS-CLM/C-P14/8 |
MATERIAL: BAKELITE XP OR EQUIVALENT OR OPAQUE MYLAR
|
Ferroxcube International Holding B.V.
|
| PC3Q16 PC316 PC3D15 |
From old datasheet system
OPAQUE MINI PACKAGE HIGH COLLECTOR EMITTER VOLTAGE TYPE PHOTOCOUPLER
|
SHARP[Sharp Electrionic Components]
|
| AMF-4F-122128-10-12P AMF-4F-009015-04-13P AMF-2F-0 |
12200 MHz - 12800 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
950 MHz - 1450 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
5800 MHz - 6500 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
7250 MHz - 7750 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
|
MITEQ INC
|
| P1395-01 P2478-01 P2405 |
Resin coating.dual type
Resin coating.dual type 树脂coating.dual类型
|
HAMAMATSU[Hamamatsu Corporation]
Hamamatsu Photonics K.K.
|
| DD2P040MA1 |
FRONT INSULATOR SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
|
| FO-EX-SCAD1-001 FO-EX-SCAD1-002 FO-EX-SCAD1-003 FO |
FRONT HOUSING SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
JAE Electronics, Inc.
|
| FQ7050BR-6.000 FQ7050A |
Resin Sealed SMD Crystal
|
Fox Electronics
|
| L4100 |
Resin-potted metal package LED
Resin-potted metal package LED 树脂盆栽金属封装的LED
|
HAMAMATSU[Hamamatsu Corporation]
Hamamatsu Photonics K.K.
|
