| PART |
Description |
Maker |
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| LCC/TLCC |
Leadless Ceramic Chip Carriers Hermetic 16-24 Terminal Standard
|
Vishay
|
| LV1145BE-70.0M LV3320BE-70.0M LV3320BV-70.0M LV114 |
6 Pad Leadless Surface Mount Oscillator
|
Pletronics, Inc.
http://
|
| ZTA-MG ZTA-MT ZTA-MX |
2 Pad and 3 Pad Ceramic Package, 5.5 mm x 10 mm
|
ILSI America LLC
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| HMC557ALC4TR HMC557ALC4TR-R5 |
24-terminal ceramic leadless chip carrier package
|
Analog Devices
|
| PL34220191000MXEX PL340 PL34020101000BDBC PL340201 |
Thermal Circuit Breaker; Current Rating:10A RoHS Compliant: Yes
Plastic Leadless Chip Carrier 塑料无引线芯片载
AS168 塑料无引线芯片载
Plastic Leadless Chip Carrier
|
http://
VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
| 0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
|
Presidio Components, Inc.
|
| MGF4953B |
SUPER LOW NOISE InGaAs HEMT Leadless Ceramic Package
|
Mitsubishi Electric Semiconductor
|
| CTLL1608-FH10NJ CTLL1608-FH10NK CTLL1608-FH12NJ CT |
1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors - Ceramic
1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD CHIP, 0603, ROHS COMPLIANT
1 ELEMENT, 0.062 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Central Technologies / CT Magnetics
|
| LCC |
Leadless Chip Carrier Package
|
Amkor Technology, Inc.
|
| M152 |
Surface Mount Leadless Chip Carrier Oscillators
|
Xsis Electronics
|
|
