| PART |
Description |
Maker |
| FI-NXB40SL-HF10 |
PCB SIDE, CONTACT COPPER ALLOY
|
Japan Aviation Electronics Industry, Ltd.
|
| MM50-200B1-1E MM50-200B1-2E MM50-200B2-1E MM50-200 |
TOP SIDE CONTACT - PHOSPHOR BRONZE
|
Japan Aviation Electronics Industry, Ltd.
|
| 0473370001 47337-0001 |
Camera Socket for Mobile Phone, Top Mount, SMT, Side Contact Type, 8.5x8.5
|
Molex Electronics Ltd.
|
| 0475860001 |
Camera Socket for Mobile Phone, Top Mount, Side Contact, 6.5x6.5 Camera Module
|
Molex Electronics Ltd.
|
| RL01-R12PE |
CONTACT - COPPER ALLOY
12 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SURFACE MOUNT
|
Japan Aviation Electronics Industry, Ltd.
JAPAN AVIATION ELECTRONICS INDUSTRY LTD
|
| FH34SRJ-45S-0.5SH |
0.5mm Pitch, 1.0mm above the board Top and Top/Bottom Contact, Back-Flip Actuator Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
|
Hirose Electric
|
| NE681M13-T3-A |
PCB COPPER CLAD POS 4X61 SIDE
|
Duracell
California Eastern Laboratories
|
| DF2404FP000 DS3404MP000 DF4504FP00K DS6207FP00K DS |
3 CONTACT(S), COPPER-FREE ALUMINUM, FEMALE, CIRCULAR CONNECTOR
3 CONTACT(S), COPPER-FREE ALUMINUM, MALE, CIRCULAR CONNECTOR, PLUG
4 CONTACT(S), COPPER-FREE ALUMINUM, FEMALE, CIRCULAR CONNECTOR
2 CONTACT(S), COPPER-FREE ALUMINUM, FEMALE, CIRCULAR CONNECTOR
2 CONTACT(S), COPPER-FREE ALUMINUM, MALE, CIRCULAR CONNECTOR, PLUG
|
THOMAS & BETTS CORP
|
| STK12C68-IM STK12C68-L45IM STK12C68-L35IM STK12C68 |
NVRAM (EEPROM Based) NVRAM中（EEPROM的基础
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:3.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board Surface Mount; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:3A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
FUSE 5A LITTLEFUSE 154005
CMOS nvSRAM 8K x 8 AutoStore Nonvolatile Static RAM Industrial Temperature/Military Screen
|
N.A.
ETC[ETC]
List of Unclassifed Manufacturers
|
| 52745-1597 0527451597 |
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style,15 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| 52745-1897 0527451897 |
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style 18 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
| FI-SE20ME |
CONTACT COPPER ALLOY
|
Japan Aviation Electronics Industry, Ltd.
|
|
