| PART |
Description |
Maker |
| M24SR02-YMC6T/2 |
2-Kbit Dynamic NFC / RFID tag with NFC Forum Tag Type 4 and I2C interface
|
ST Microelectronics
|
| M24SR16-YMC6T/2 M24SR16-YDW6T/2 |
16-Kbit Dynamic NFC / RFID tag with NFC Forum Tag Type 4 and I2C interface
|
ST Microelectronics
|
| MCM32A932SG33 MCM32A732SG33 MCM32A864SG33 MCM32A76 |
128KB/256KB Secondary Cache Module With Tag, Valid, and Dirty for i486 Processor Systems
OSC 5V 8PIN TTL 64K X 32 CACHE TAG SRAM MODULE, 25 ns, DMA112
|
Motorola, Inc.
Motorola Mobility Holdings, Inc.
|
| FPE210 PEF220 |
Plate Capacitors with Moisture Protection Plate Capacitors for Higher Voltages
|
Vishay Siliconix
|
| 71256T36-67 71256T36-75 GVT71256T18 71256T36-10 7C |
256K x 18 Synchronous-Pipelined Cache Tag RAM 256 × 18的同步高速缓存标记内存流水线
256K x 18 Synchronous-Pipelined Cache Tag RAM 256K X 18 CACHE TAG SRAM, 3.5 ns, PQFP100
|
Cypress Semiconductor Corp.
Cypress Semiconductor, Corp.
|
| BSM25GB120DN2 C67076-A2109-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
Circular Connector; No. of Contacts:19; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Right Angle Plug; Insert Arrangement:14-19 IGBT功率模块（半桥包括快速续流二极管的绝缘金属基片包
|
Siemens Semiconductor G...
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
SIEMENS A G
|
| 609-1483 D09S13A4GV00LF D09S13A6GV00LF D15S13A4GV0 |
SCREWLOCK, HARPON, METAL PLATE.
SCREWLOCK, HARPOON,METAL PLATE. SCREWLOCK,HARPOON,METAL PLATE.
|
FCI connector
|
| BSM50GB120DN2 C67076-A2105-A70 |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; No. of Contacts:18; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
|
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
| BSM50GD120DN2E3226 050D12E2 C67070-A2514-A67 |
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes Package with insulated metal base plate) 50 A, 1200 V, N-CHANNEL IGBT
Circular Connector; No. of Contacts:41; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:22-41
From old datasheet system
|
SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
|
| E3460M1EN1S E3460N1EN1S E3460Q1EN1S E3460Y1EB1S E3 |
Single Phase Bridge 单相
Silicon Power Rectifier Assemblies Plate Heatsink SILICON, VOLTAGE MULTIPLIER DIODE
Silicon Power Rectifier Assemblies Plate Heatsink SILICON, RECTIFIER DIODE
Silicon Power Rectifier Assemblies Plate Heatsink SILICON, BRIDGE RECTIFIER DIODE
Silicon Power Rectifier Assemblies Plate Heatsink 3 PHASE, SILICON, BRIDGE RECTIFIER DIODE
3 Phase Bridge
Silicon Power Rectifier Assemblies Plate Heatsink
|
MICROSEMI CORP-COLORADO
Cornell Dubilier Electronics, Inc.
Microsemi, Corp.
http://
MICROSEMI[Microsemi Corporation]
|
| UHFRFIDHARSH-TAG-150 |
TAG-ON-METAL
|
Premo
|
