PART |
Description |
Maker |
MM70-314-310B1-1 MM70-314-310B1-2 |
TOP SIDE CONTACT - COPPER ALLOY
|
Japan Aviation Electronics Industry, Ltd.
|
39-00-0220 39-00-0222 39-00-0054 |
Crimp Pin Contact; Wire Size (AWG):24-18; Body Material:Phosphor Bronze; Series:5558; Operating Temp. Min:-40 C; Pitch Spacing:4.2mm; Voltage Rating:600V PHOSPHOR BRONZE, GOLD (30) OVER NICKEL FINISH, WIRE TERMINAL Multipole Connector; Body Material:PA Polyamide (Nylon) 6/2; Connecting Termination:Crimp; Operating Voltage:250V; Pitch Spacing:0.062" RoHS Compliant: Yes PHOSPHOR BRONZE, GOLD (30) OVER NICKEL FINISH, WIRE TERMINAL Connector Contact,PIN,CRIMP Terminal
|
Molex, Inc. MOLEX INC
|
PS-SLA-C2-1 PS-SLA-C2-2 PS-SLA-C2-3 PS-SLA-C2-4 |
CONTACT - PHOSPHOR BRONZE
|
Japan Aviation Electronics Industry, Ltd.
|
1ZC24A 1ZC43A 1ZC20A 1ZC33A 1ZC36A 1ZC12A1ZC120A E |
From old datasheet system CONSTANT VOLTAGE REGULATION TELEPHONE, PRINTER USES Card Edge Connector; Number of Contacts:36; Pitch Spacing:1mm; Tail Length:3.00mm; Contact Termination:Solder; Connector Mounting:PC Board; Contact Material:Phosphor Bronze; Contact Plating:Tin; Leaded Process Compatible:Yes Card Edge Connector; Number of Contacts:64; Pitch Spacing:1mm; Tail Length:3.00mm; Contact Termination:Solder; Connector Mounting:PC Board; Contact Material:Phosphor Bronze; Contact Plating:Tin; Leaded Process Compatible:Yes DIODE(CONSTANTVOLTAGEREGULATION) DIODE (CONSTANT VOLTAGE REGULATION) 二极管(恒压规管
|
TOSHIBA[Toshiba Semiconductor] Toshiba Corporation ToshibaSemiconductor Toshiba, Corp.
|
0936010008 |
GWconnect Stamped Crimp Contact for 10A Inserts and Modules, Female, Tin (Sn) Plated Phosphor Bronze
|
Molex Electronics Ltd.
|
53258-3007 |
3.50mm (.138) Pitch Header, Vertical, Lead-free, 7 Circuits, Phosphor Bronze (CuSn)Contact
|
Molex Electronics Ltd.
|
0430300012-18 |
Micro-Fit 3.0 Crimp Terminal, Female, with Select Gold (Au) Plated Phosphor Bronze Contact, 26-30 AWG, Bag
|
Molex Electronics Ltd.
|
52745-1897 0527451897 |
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Top Contact Style 18 Circuits, Lead-free, Gold (Au) Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
0522071460 52207-1460 |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 14 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
0522071260 52207-1260 |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 12 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
|
Molex Electronics Ltd.
|
HLMP-C027-P0000 HLMP-C608-R00DD HLMP-C025-P0002 HL |
0.5mm contact spacing, 1.0mm height, Top contact, Back flip FPC/FFC connectors; HRS No: 580-1225-5 50; Contact Mating Area Plating: Gold T-1 3/4 (5 mm) AlInGaP Lamp 的T 1 3 / 45毫米)的AlInGaP T-13/4 (5mm) AlInGaP Lamp 的T 13 / 4mm)的铝铟镓磷化物
|
Taiwan Semiconductor Co., Ltd. Avago Technologies, Ltd.
|