| PART |
Description |
Maker |
| 70287-1001 0702871001 SD-70287-004 |
2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 0942460112 94246-0112 SD-94246-002 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole, PCT, Vertical, 12 Circuit, Blue
|
Molex Electronics Ltd.
|
| 71764-0006 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
| MMB1901R480 MM-B1901-R480 36512-0196 0365120196 |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, Through Hole, 0.4μm (16μ) Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4渭m (16渭") Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4楼矛m (16楼矛") Selective Gold (Au), 48 Circuits
|
Molex Electronics Ltd.
|
| 0022282049 22-28-2049 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Backwalls Removed
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, with Backwalls Remove
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, with Backwalls Rem
|
Molex Electronics Ltd.
|
| 0022282023 22-28-2023 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022284108 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022284105 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022282035 22-28-2035 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 3 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, with Kinked PC Tai
|
Molex Electronics Ltd.
|
| 0022282025 22-28-2025 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, with Kinked PC Tails
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, with Kinked PC Tai
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
