| PART |
Description |
Maker |
| CP-8-9 |
8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 x 3 mm Body, Very Thin, Dual Lead
|
Analog Devices
|
| C927U222MYWDAA7317 |
Ceramic, Safety, C900_Y, 2200 pF, 20%, Y5U, Lead Spacing = 7.5mm
|
Kemet Corporation
|
| C967U472MYWDBA7317 |
Ceramic, Safety, C900_Y, 4700 pF, 20%, Y5U, Lead Spacing = 7.5mm
|
Kemet Corporation
|
| R49AI31000001K |
Capacitor, film, 0.1 uF, 10 Tol, -40/ 110C, Safety: X1, 310VAC, Lead Spacing=15 mm
|
Kemet Corporation
|
| C927U152MYWDBA7317 |
Ceramic, Safety, C900_Y, 1500 pF, 20%, Y5U, Lead Spacing = 7.5mm
|
Kemet Corporation
|
| PME271M660KR30 |
Capacitor, film, 0.6 uF, /-10% Tol, -40/ 110C, Safety: X2, 275 VAC, Lead Spacing=25.4 mm
|
Kemet Corporation
|
| R463F210050N0K |
Capacitor, film, 0.01 uF, /-10% Tol, -40/ 110C, Safety: X2, 310 VAC, Lead Spacing=10 mm
|
Kemet Corporation
|
| T356E106K016AT7301 |
Capacitor, Tantalum, General Purpose Radial Conformal (Dipped), 10 uF, /-10% Tol, 16 V, Lead Spacing=5.08 mm
|
Kemet Corporation
|
| C4ASPBU3470A3GJ |
Film, Metallized Polypropylene, Power, C4AS, 0.47 uF, 5%, 1,200 V, 70C, Lead Spacing = 27.5mm
|
Kemet Corporation
|
|
