| PART |
Description |
Maker |
| 200170MR030G21ZA |
2.0mm DUAL ROW HEADER WITH LATCH EJECT
|
SUYIN USA, INC.
|
| 1-1734493-2 1-1734493-4 4-1734493-8 4-1734493-6 4- |
AMPMODU 2.0mm PITCH, RIGHT ANGLE, DUAL ROW, THRU-HOLE
|
Tyco Electronics
|
| 200139FR |
2.0mm DUAL ROW SOCKET RIGHT ANGLE DIP TYPE
|
SUYIN USA, INC.
|
| B24 B2412BCC1 B24140BGA1 B2412BBA1 B24140BBA1 B241 |
FEMALE HEADER PROFILE : 5.0mm DUAL-ENTRY TYPE 母简介：5.0mm使用双入
|
DB Lectro Inc.
DB Lectro, Inc.
|
| ZP7-10-SS-G ZP7-36-SS-G ZP7-68-SS-G ZP7-20-SS-G ZP |
180隆? SMT - Dual Row Box Header
180° SMT - Dual Row Box Header
|
Yamaichi Electronics Co., Ltd.
|
| 0621002000 |
IDT Ribbon Cable Module Operating Instruction for 2.0mm Milli-Grid Dual row 87568 Series
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 200124F |
2.0mm DUAL ROW CRIMP HOUSING & CRIMP TERMINAL
|
SUYIN USA, INC.
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| D2PH204-U130-SMT488PPTR |
DUAL ROW PIN HEADER
|
Adam Technologies, Inc.
|
|
