| PART |
Description |
Maker |
| HJD-2Z-1.9G |
1800 MHz - 1990 MHz RF/MICROWAVE 180 DEGREE HYBRID COUPLER, 0.3 dB INSERTION LOSS-MAX
HYBRID JUNCTION
|
MERRIMAC INDUSTRIES INC
Merrimac Industries, Inc.
|
| H-183-4SMA H-183-4 |
Microwave Hybrid Junction 30 MHz - 3 GHz
|
MACOM[Tyco Electronics]
|
| U1BC44 U1GC44 U1JC44 |
RECTIFIER SILICON DIFFUSED JUNCTION TYPE FOR HYBRID USE
TOSHIBA RECTIFIER SILICON DIFFUSED JUNCTION TYPE
|
TOSHIBA[Toshiba Semiconductor]
|
| HH-108 HH-108SMA HH-108BNC |
200 kHz-35 MHz,high-power hybrid lunction
HIGH-POWER HYBRID JUNCTION 200 KHZ - 35 MHZ
|
MA-Com
MACOM[Tyco Electronics]
|
| SMC6M40-10-1 SMC6M40-25 SMC6M40-25-1 SMC6M40-10 SM |
Brushless DC Motor Driver Module in a Power Flatpack 80-200V, 50 Amp BRUSHLESS DC MOTOR CONTROLLER, 60 A, DFM43
Brushless DC Motor Driver Module in a Power Flatpack 100-250V, 40 Amp
|
Sensitron Semiconductor
|
| PIC-MSM-332 |
Flatpack Magnet
|
PIC GmbH
|
| HH-106PIN |
Available in Flatpack and Connectorized Packages
|
M/A-COM Technology Solu...
|
| STK760-221A-E |
Thick-Film Hybrid IC Single-phase Rectification PFC Hybrid IC
|
Sanyo Semicon Device
|
| MS-324-4 MS-324-4-2 MS-324-4-3 MS-324-4-4 |
Form C Reed Sensor - Flatpack
Form C Reed Sensor ・ Flatpack
|
PIC GmbH
DB Lectro Inc
|
| MS-332-5-6 MS-332-6 |
Power Reed Sensor - Flatpack
|
PIC GmbH
|
| MQFP PQFP |
Metric Plastic Quad Flatpack Packages
|
Intersil Corporation
|
| MD-156PIN MD-156 |
Flatpack Double-Balanced Mixer, 0.6 - 3 GHz
|
Tyco Electronics
|
