PART |
Description |
Maker |
CYM1828HG-25C |
32K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
|
Intersil, Corp.
|
MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
MC-789406 MC-7894-AZ MC-7894 |
GaAs MULTI-CHIP MODULE
|
Duracell CEL[California Eastern Labs]
|
MC-7832-HA MC-7832-HA-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
FDMF6730 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
AT68166FT-YM25-E AT68166FT-YM25-SCC AT68166FT-YS18 |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
585-2325 585-2225 585-2211 585-2413 585-2415 585-2 |
Multi-Chip BASED LED T 1 3/4 Wedge BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation Dialight PLC
|
DPZ256X16IH3-17C DPZ256X16II3-17C |
256K X 16 FLASH 12V PROM MODULE, 170 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48 256K X 16 FLASH 12V PROM MODULE, 170 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
|
Twilight Technology, Inc.
|
SMFLHP283R3S SMFLHP2805D SMFLHP2812D SMFLHP2805D07 |
Parallel operation with current share, up to 3 units (228 watts) 2-OUTPUT 100 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12 2-OUTPUT 80 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
|
Interpoint Corporation Company Standard Power
|
WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32 512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32 512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
SKY77441 |
Multi-Mode / Multi-Band PA Module
|
Skyworks Solutions Inc.
|