| PART |
Description |
Maker |
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| EUA2011HIR1 EUA2011JIR1 |
FAN,115VAC,78CFM,120X120X38 DUAL BALL,TERMINAL,UL/CE/CUL 3单声道无滤波器D类音频功率放大器
FAN,220VAC,110CFM,120X120X38 BALL,TERMINAL,UL/CE/TUV/CUL 3单声道无滤波器D类音频功率放大器
FAN,12VDC,9.27CFM,51X51X10,.8W BALL,10.5"LEADS,UL/CUL/TUV/CE
|
Eutech Microelectronics, Inc.
寰蜂俊绉???′唤??????
|
| LD08PC753KAB3A LD08PC753KAB1A LD05-20 LD20 LD13 LD |
CAPACITOR, CERAMIC, MULTILAYER, 250 V, X7R, 0.075 uF, SURFACE MOUNT, 1808 CHIP
Tip & Ring Tin/Lead Termination “B Multilayer Ceramic Chip Capacitors
Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
|
AVX, Corp.
AVX Corporation
|
| GCJ21BR71H105MA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| GRJ21AR72E102KWJ1 |
Chip Monolithic Ceramic Capacitor Soft Termination Type
|
Murata Manufacturing Co...
|
| GCJ188R71E105KA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| GCJ188R91H224KA01 |
Soft Termination Chip Multilayer Ceramic Capacitors for Automotive
|
Murata Manufacturing Co...
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| JE10 JE1046ZTL2R JE10112HL1 JE10112HL1R JE10112HL2 |
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.1pF; Voltage: 100V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±1%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 50V; Tolerance: ±10%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60)
MINIATURE HIGH POWER LATCHING RELAY 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 1.2pF; Voltage: 50V; Tolerance: ±0.25pF; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 10pF; Voltage: 100V; Tolerance: ±5%; TC: BP; Chip Size: SMD-0805; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
Ceramic Chip Capacitors to MIL-PRF-123; Capacitance: 100pF; Voltage: 100V; Tolerance: ±10%; TC: BP; Chip Size: SMD-1206; Termination: Nickel Guarded, Solder Coated (Sn60) 微型大功率磁保持继电
MINIATURE HIGH POWER LATCHING RELAY
|
HONGFA[Hongfa Technology]
厦门宏发电声股份有限公司
Xiamen Hongfa Electroacoustic Co., Ltd.
???瀹???靛０?′唤??????
|
