| PART |
Description |
Maker |
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| MOC211 MOC211-M MOC212 MOC212-M MOC213 MOC213-M MO |
8-Pin SOIC Phototransistor Output Optocoupler; Package: SOIC-W; No of Pins: 8; Container: Tape & Reel 1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
(MOC211 - MOC213) SMALL OUTLINE OPTOCOUPLERS TRANSISTOR OUTPUT
|
飞思卡尔半导体(中国)有限公司
Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
|
| WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT416 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOP-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
