PART |
Description |
Maker |
TC2696 |
2 W Flange Ceramic Packaged PHEMT GaAs Power FETs From old datasheet system
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TRANSCOM ETC[ETC]
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LT3D65W LT3E65W LT3H65W LT3K65W LT3S65W |
mm(T-1), Cylinder Type(Thick Flange), Colored Transparency, Tape-packaged LED Lamps for Surface Mount
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SHARP
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QEN101 |
Ceramic SMID Packaged
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Temex Components
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QESM06 |
SMD 4.0x2.5 Crystal - Ceramic SMD packaged
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TEMEX
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TGA8658-EPU-SG |
Packaged Ku-band HPA Ku Band 2W Packaged Amplifier
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TRIQUINT[TriQuint Semiconductor]
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AM2964B/BQA AM2964B/BUA AM2964BPC AM2964BDMB AM296 |
3 Phase Driver, Inverting Input, 0.8us Deadtime in a 28-pin DIP package; A IR2132 packaged in a 28-Lead SOIC shipped on Tape and Reel 3 Phase Driver, Inverting Input, 2.5us Deadtime in a 28-pin DIP package; A IR2130 packaged in a 28-Lead PDIP Half Bridge Driver, Soft Turn-On, Separate High and Low Side Inputs, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2108 packaged in a 8-Lead PDIP DRAM控制 3 Phase Driver, Inverting Input, 2.5us Deadtime in a 28-pin DIP package; A IR2130 packaged in a Lead-Free 28-Lead SOIC DRAM控制 Half Bridge Driver, SoftTurn-On, Noninverting Inputs in a 8-pin DIP package; A IR2304 packaged in a 8-Lead SOIC DRAM控制
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NXP Semiconductors N.V.
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PS7841C-A11 PS7841C-A15 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21366 packaged in a Lead-Free 28-Lead SOIC Single Low Side Driver, Current Limiting, Programmable Shutdown Error Pin in a 8-pin DIP package; A IR2121 packaged in a Lead-Free 8-Lead PDIP
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NEC, Corp.
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CC0805ZRY5V6BB103 CC0805ZRY5V5BB103 CC0805ZRY5V7BB |
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS14 SURFACE-MOUNT CERAMIC CERAMIC SURFACE-MOUNT CERAMIC SURFACE-MOUNT CERAMIC SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS SURFACE-MOUNT CERAMIC CERAMIC This cpecification describes Y5V series chip catacitors with lead-free terminations. SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS14
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YAGEO Corporation List of Unclassifed Man...
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LSP1004 LSP1011 LSP1000 LSP1012 LSP1002 LSP1004-35 |
35 V, SILICON, PIN DIODE ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES 增强性能表面贴装绕流封装器件 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
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MICROSEMI CORP-LOWELL Microsemi, Corp. MICROSEMI[Microsemi Corporation]
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PD25 PD26 PD24 PS56 PS85 PS88 PS58 PS87 PS560 PS58 |
3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead PDIP 3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a Lead-Free 28-Lead SOIC High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged Half Bridge Driver, SoftTurn-On, Low Side Inverting Input, Separate High and Low Side Input, 500ns Deadtime in a 8-pin DIP package; A IR2183 packaged 3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21363 packaged in a Lead-Free 28-Lead SOIC 3 Phase Driver, Soft Turn-on, Inverting Input Separate High and Low Side Inputs, 200ns Deadtime.; A IR21367 packaged in a 28-Lead PDIP Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a Lead-Free 8-Lead Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead SOIC High and Low Side Driver in a 14-pin DIP package; A IR2010 packaged in a Lead-Free 16-Lead SOIC Half Bridge Driver, Soft Turn-On, Single Input Plus Shut-Down, Fixed 500ns Deadtime in a 8-pin DIP package; A IR2109 packaged in a 8-Lead SOIC and Power Ground, Programmable Deadtime in a 14-pin DIP package; A IR21834 packaged in a 14-Lead PDIP Single High Side Driver, Noninverting Input in a 8-pin DIP package; A IR2117 packaged in a 8-Lead PDIP High voltage, high speed power MOSFET and IGBT driver with three independent high side and low side referenced output channels and with DC Bus Single High Side Driver, Noninverting Inputs, Current Sensing, Overcurent Detection and Shutdown Fault Output in a 8-pin DIP package; A IR2127 Analog IC 模拟IC 3 Phase Driver, Separate High and Low Side Inputs, 200ns Deadtime in a 28-pin DIP package; A IR2135 packaged in a 28-Lead SOIC shipped on Tape and Reel 模拟IC High and Low Side Driver, All High Voltage Pins On One Side, Separate Logic and Power Ground, Shut-Down in a 14-pin DIP package; A IR2110 packaged in a 16-Lead SOIC shipped on Tape and Reel
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Lattice Semiconductor, Corp.
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ISL4238EIRZ ISL4245EIRZ-T ISL4238E ISL4238EIR ISL4 |
QFN Packaged, 卤15kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown(QFN灏??, 卤15kV ESD ?叉?, 2.7V??5.5V, 10Nanoamp, 250kbps/1Mbps, ?锋????????????S-232?跺??? 5V High-Speed RS-232 Transceivers with 0.1uF Capacitors TRIPLE LINE TRANSCEIVER, PQCC32 QFN Packaged, ±15kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown(QFN封装, ±15kV ESD 防护, 2.7V5.5V, 10Nanoamp, 250kbps/1Mbps, 具有自动断电功能的RS-232收发 QFN Packaged, 5kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/ 1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown QFN Packaged, 【15kV ESD Protected, 2.7V to 5.5V, 10Nanoamp, 250kbps/ 1Mbps, RS-232 Transceivers with Enhanced Automatic Powerdown
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Intersil, Corp. INTERSIL[Intersil Corporation]
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