| PART |
Description |
Maker |
| MLPM-6PIN |
Package Dimensions
|
IRF[International Rectifier]
|
| PM2IV1 |
Package Dimensions in mm
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| MELF |
Package Dimensions
|
Galaxy Semi-Conductor H...
|
| TSSOP-8PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
|
| ULTRATHIN-5PIN |
Package Dimensions 封装尺寸
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029133013 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| SOT-343 |
Package Dimensions in mm 在毫米封装尺
From old datasheet system
|
Vishay Intertechnology, Inc.
Vishay Siliconix
|
| R-8 |
8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions
|
Analog Devices
|
| HT-210UDUYG HT-210USDNB HT-210SDYG HT-210YYG HT-21 |
Package Outline Dimensions
Package Outline Dimensions
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| CB-9-1 |
9-Ball Wafer Level Chip Scale Package [WLCSP] Dimensions shown in millimeters
|
Analog Devices
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
