PART |
Description |
Maker |
MPC2107SG66 |
256KB and 512KB burstRAM secondary cache module
|
Motorola
|
MPC2004 MPC2005 |
256KB and 512KB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms 256KB12KB的二级缓存模块BurstRAM为PowerPC制备/ CH旺平
|
Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola Inc] MOTOROLA[Motorola, Inc]
|
IDT7MPV6253 IDT7MPV6253S15M IDT7MPV6253S66M IDT7MP |
256KB AND 512KB SECONDARY CACHE MODULES FOR THE PowerPCO
|
IDT Integrated Device Technology
|
LH28F400BVHE-TL85 |
4MB (512KB x 8/256KB x 16) SmartVoltage Flash Memory(4M512Kx 8/256K位x 16)闪速存储器)
|
Sharp Corporation
|
CXK79M72C164GB CXK79M36C164GB |
18Mb 1x1Dp HSTL High Speed Synchronous SRAMs (256Kb x 72 or 512Kb x 36)
|
Sony Corporation
|
M29F400B M29F400T 5127 |
4 Mbit (512Kb x8 or 256Kb x16, Boot Block)Single Supply Flash Memory From old datasheet system
|
STMicro
|
CY14B104NA-ZSP20XCT CY14B104NA-ZSP20XIT CY14B104LA |
4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 256Kb x 16; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: TSOP 256K X 16 NON-VOLATILE SRAM, 20 ns, PDSO54 4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 512Kb x 8; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA 4 Mbit (512K x 8/256K x 16) nvSRAM; Organization: 256Kb x 16; Vcc (V): 2.7 to 3.6 V; Density: 4 Mb; Package: FBGA
|
Cypress Semiconductor, Corp. CYPRESS SEMICONDUCTOR CORP
|
FM18L08 FM18L08-70-P FM18L08-70-S |
.050 X .050 MICRO STRIPS 256Kb.7 - 3.6V的Bytewide FRAM存储 256Kb 2.7-3.6V Bytewide FRAM Memory
|
Electronic Theatre Controls, Inc. List of Unclassifed Manufacturers ETC[ETC] Ramtron International
|
GSM31P256KB-I66 GSM31P512KB-I66 |
x64 Interleaved Burst Mode SRAM Module 256KB Secondary Cache Module Designed For Use With Intel Pen-tium CPU based system(用于英特尔奔腾处理器系统56KB二级高速缓冲存储器) 512KB Secondary Cache Module Designed For Use With Intel Pen-tium CPU based system(用于英特尔奔腾处理器系统12KB二级高速缓冲存储器)
|
GSI Technology
|