| PART |
Description |
Maker |
| 44A0212 |
This specification sheet forms a part of the latest issue of Raychem Specification 44 and MIL-W-81044 as applicable.
|
Tyco Electronics
|
| 55PC1221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0226 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC0223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| CMLT6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, PICOmini SILICON NPN DARLINGTON TRANSISTOR
From old datasheet system
an Enhanced Specification, PICOmini™, NPN Silicon
|
CENTRAL[Central Semiconductor Corp]
Central Semiconductor Corporation
|
| ST16-19RFRDCS 7759 ST16 ST19-RFRDCS ST16-RFRDCS |
ST16-19RFRDCS CHIP SET INTERFACE SPECIFICATION
CHIP SET INTERFACE SPECIFICATION
From old datasheet system
|
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| XPC745BPX350LD XPC745BPX300LD MPC755BLDPND MPC755B |
MPC755 Part Number Specification for the XPC755BxxnnnLD and XPC745BxxnnnLD Series
Part Number Specification for the XPC755BxxnnnLD andXPC745BxxnnnLD Series
|
Motorola
|
| CGA5L3X7R2E333K160AA |
SPECIFICATION
|
TDK Electronics
|
| TFS82A |
Specification
|
VECTRON[Vectron International, Inc]
|
| TFS170D |
Specification
|
VECTRON[Vectron International, Inc]
|
| RC2012J471CS |
SPECIFICATION
|
Samsung semiconductor
|
| CL10A106MP8NNNC |
SPECIFICATION
|
Samsung semiconductor
|
