| PART |
Description |
Maker |
| F4655-1305 |
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 μm Channel Diameter
High-Speed Response MCP Assembly Ideal for High Resolution TOF-MS Detector Incorporates a Two-Stage MCP with 4 レm Channel Diameter
|
Hamamatsu Corporation
|
| M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| M6MGD137W34DKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
| F4655-12 |
COMPACT MCP ASSEMBLY FOR TOF
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F4294-09 |
MCP ASSEMBLY WITH CENTER HOLE FOR REFLECTRON MS
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品（MCP）的512兆位2兆16位）的CMOS 1.8伏，只有同时写，突发模式闪存
|
Spansion Inc.
Spansion, Inc.
|
| S71PL129JB0BAW9U3 S71PL129JB0BAI9U0 S71PL129JB0BAI |
JT 18C 18#20 PIN WALL RECP 堆叠式多芯片产品（MCP）的快闪记忆
JT 15C 14#20 1#16 PIN WALL REC SPECIALTY MEMORY CIRCUIT, PBGA64
JT 15C 14#20 1#16 SKT PLUG 堆叠式多芯片产品（MCP）的快闪记忆
JT 37C 37#22D SKT PLUG
Circular Connector; No. of Contacts:37; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:14-35 RoHS Compliant: No
Stacked Multi-Chip Product (MCP) Flash Memory
|
Spansion, Inc.
Spansion Inc.
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
