| PART |
Description |
Maker |
| F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Corporation
|
| F4655-12 |
COMPACT MCP ASSEMBLY FOR TOF
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| F4655-01 |
WIDE DYNAMIC RANGE MCP ASSEMBLY FOR HELIUM LEAK DETECTOR
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| GRS-4023A-0009 |
ASSEMBLY ROCKER SWIDGET D.P. - CENTER OFF (ON-OFF-ON)
|
CW Industries
|
| GRS-4023A-1300 |
ASSEMBLY ROCKER SWIDGET D.P. - CENTER OFF (ON-OFF-ON)
|
CW Industries
|
| GRS-4013A-0008 |
ASSEMBLY ROCKER SWIDGET S.P - CENTER OFF (ON-OFF-ON)
|
CW Industries
|
| F2224-11M F2224-11P F2224-11S F2224-14 F2224-14M F |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics
|
Hamamatsu Corporation
|
| S75PL127NBFJFWGZ2 S75PL127NCFJFWGZ3 S75PL256NCFJFW |
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| S71NS032JA0BJWRT0 S71NS032J80BJWRA |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA56
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion, Inc.
|
| 0878311029 87831-1029 |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
2.00mm (.079) Pitch Milli-Grid?Header, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
|
Molex Electronics Ltd.
|
| 87831-2628 |
2.00mm (.079) Pitch Milli-Grid Header, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot
|
Molex Electronics Ltd.
|
