| PART |
Description |
Maker |
| STV0498 |
DOCSIS 2.0 cable modem chip with channel bonding
|
STMicroelectronics
|
| S8650 |
Si PIN photodiode Flat surface ideal for bonding to scintillator
|
Hamamatsu Corporation
|
| TAB-35006 |
Tape Carrier Package/Tape Automated Bonding (TCP/TAB)
|
Yamaichi Electronics
|
| PC1604-A |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| PG192128-A |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| AMC0802A |
CONTOUR DRAWING & BLOCK DIAGRAM 轮廓
CONTOUR DRAWING & BLOCK DIAGRAM
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| PC1602-J |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
http://
|
| PC1602F |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
http://
|
| TQ5M31K |
BLOCK DIAGRAM
|
TRIQUINT[TriQuint Semiconductor]
|
| MC9RS08KA8CPG MC9RS08KA8CPJ MC9RS08KA8CTG MC9RS08K |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
| MC9RS08LE4 |
MCU Block Diagram
|
Freescale Semiconductor, Inc
|
