| PART |
Description |
Maker |
| MICRF008 MICRF008BM |
QwikRadio?/a> Sweep-Mode Receiver
QwikRadio™ Sweep-Mode Receiver
QwikRadio Sweep-Mode Receiver
QwikRadio⑩ Sweep-Mode Receiver
QwikRadioSweep-Mode Receiver QwikRadio系列⑩扫描模式接收机
|
MICREL[Micrel Semiconductor]
Micrel Semiconductor,Inc.
Micrel Semiconductor, Inc.
|
| 87705-7911 0877057911 |
1.00mm (.039) Pitch DDR-II DIMM 240 Circuits Socket, Vertical, 1.8 Voltage, 2.54mm (.100) Tail Length, Black Latches, Nylon 4/6 Glass-filled, Black Housing
|
Molex Electronics Ltd.
|
| 87705-7453 0877057453 |
1.00mm (.039) Pitch DDR-II DIMM 240 Circuits Socket, Vertical, 1.8 Voltage, 3.00mm (.118) Tail Length, Black Latches, Nylon 4/6 Glass-filled, Black Housing
1.00mm (.039") Pitch DDR-II DIMM 240 Circuits Socket, Vertical, 1.8 Voltage, 3.00mm (.118") Tail Length, Black Latches, Nylon 4/6 Glass-filled, Black Housing
|
Molex Electronics Ltd.
|
| 90816-3216 0908163216 |
1.27mm (.050") Pitch Picoflex庐 SMT Latched Vertical Header, 16 Circuits, Gold (Au) Plating, Black
1.27mm (.050) Pitch Picoflex? SMT Latched Vertical Header, 16 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
| 0908160324 090816-0324 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 24 Circuits, Tin (Sn) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 24 Circuits, Tin (Sn) Plating, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0901301128 90130-1128 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 28 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
| 0942403318 94240-3318 SD-94240-001 |
2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole, PBT, Vertical, 18 Circuits, Black
2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole, PBT, Vertical, 18 Circuits, Black
MOLEX Connector
|
Molex Electronics Ltd.
|
| 90130-1230 0901301230 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0877159900 87715-9900 |
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38μm (15μ) Gold (Au) Plating, with Plastic Pegs
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38渭m (15渭) Gold (Au) Plating, with Plastic Pegs
|
Molex Electronics Ltd.
|
| 34707-2060 |
Stac64?2 Bay Vertical Headers, 32 Circuits, Bay A 20 Circuit Signal Header, Polarization A, Black; Bay B 12 Circuit Signal Header, Polarization A, Black, Tray
|
Molex Electronics Ltd.
|
| 0908163512 90816-3512 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 12 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
| 90816-3306 0908163306 |
1.27mm (.050) Pitch Picoflex SMT Latched Vertical Header, 6 Circuits, Gold (Au) Plating, Black
1.27mm (.050") Pitch Picoflex SMT Latched Vertical Header, 6 Circuits, Gold (Au) Plating, Black
|
Molex Electronics Ltd.
|
|
