| PART |
Description |
Maker |
| HMD4M144D9WG-5 HMD4M144D9WG-6 HMD4M144D9WG |
64Mbyte(4Mx144) 200-pin ECC Mode 4K Ref. DIMM Design 5V
|
Hanbit Electronics Co.,Ltd
|
| M368L3223FTN-CB3LAA M368L1624FTM-CB3AA M381L6423FT |
184pin Unbuffered Module based on 256Mb F-die with 64/72-bit Non-ECC / ECC 184pin缓冲模块，基56Mb的F -死去64/72-bit非ECC / ECC
|
Sanken Electric Co.,Ltd.
Sanken Electric Co., Ltd.
|
| M381L6423ETM-LC5 M368L3223ETM-CC5 M368L3223ETM-LC5 |
184pin Unbuffered Module based on 256Mb E-die 64/72-bit ECC/Non ECC
|
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| KVR16E11K4-32I |
PC3-12800 CL11 ECC 240-Pin DIMM Kit
|
List of Unclassifed Man...
|
| V4374128C24V V4374128C24VXXG-10PC V4374128C24VXXG- |
1GB 168-PIN REGISTERED PLL ECC SDRAM DIMM 3.3 VOLT 128M x 72
|
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
| VL-MM9-4SBN |
4GB 512Mx64 DDR3 SDRAM LOW VOLTAGE NON-ECC UNBUFFERED SODIMM 204-PIN
|
List of Unclassifed Manufacturers
|
| M374S6553BTS-C7A M366S2953BTS-C7A M366S3354BTS M36 |
SDRAM Unbuffered Module 168pin Unbuffered Module based on 512Mb B-die 62/72-bit Non ECC/ECC
|
SAMSUNG[Samsung semiconductor]
|
| 74062-2503 0740622503 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| 74062-2513 0740622513 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
| 74061-2511 0740612511 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 4.75mm (.187)
2.00mm (.079") Pitch VHDM垄莽 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 4.75mm (.187")
|
Molex Electronics Ltd.
|
