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CC1V-T1M - SM Crystal Mil Temp Low Freq

CC1V-T1M_612830.PDF Datasheet


 Full text search : SM Crystal Mil Temp Low Freq


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CC6F CC6F06 SM Crystal Mil Temp High Freq Fundamental
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ADVANCED MICRO DEVICES INC
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ADA4891-3ARU-EBZ ADA4891-4ARU-EBZ ADA4891-1ARJ-EBZ Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: MICRO SOIC, 8 Pin, Ind Temp -40°C – 125 °C, 7" Tape and Reel MSOP RM-8 H1U OP-AMP, PDSO8
Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: SOIC 150 MIL, 8 Pin, Ind Temp -40°C – 125 °C, 7" Tape and Reel R-8 OP-AMP, PDSO8
Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: SOIC 150 MIL, 8 Pin, Ind Temp -40°C – 125 °C, 13" Tape and Reel R-8 OP-AMP, PDSO8
Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers, Package: MICRO SOIC, 8 Pin, Ind Temp -40°C – 125 °C, MSOP 13" Tape and Reel RM-8 H1U OP-AMP, PDSO8
Low Cost CMOS, High Speed, Rail-To-Rail Amplifiers , Package: SOIC 150 MIL, 8 Pin, Temp: Ind -40°C – 125 °C OP-AMP, PDSO8
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Analog Devices, Inc.
ANALOG DEVICES INC
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Intersil Corporation
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SH2 Series, 7149 Group, Three ADC circuits, 6-ch 16-bit MTU2, 3-ch 16-bit MTU2S, Port Output Enable, 2-ch CMT, UBC, 15 mA IO FP-80WV; Vcc= 4.0 to 5.5 volts, Temp= -20 to 85 C; Package: PLQP0080JA-A
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Saronix
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901-10511-2 HIGH FREQ END LAUNCH SMA JACK ASSEMBLY, PC MOUNT, 10 MIL PIN
Amphenol Corporation
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Emerson Network Power
5962D9960601QUA 5962D9960601QUC 5962D9960601QUX 59 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose none.
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish factory option.
512K x 8 SRAM. 100ns access time, 5V operation. Extended industrial temp rang flow. Lead finish gold.
Aeroflex Circuit Technology
 
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