| PART |
Description |
Maker |
| STW9B12G |
Thermally Enhanced Package Design
|
Seoul Semiconductor
|
| STW9C2SA |
Thermally Enhanced Package Design
|
Seoul Semiconductor
|
| GS8000 GS8000-063 GS8000-03X GS8000-095 GS8000-126 |
Increase package design flexibility while maintaining electrical integrity
|
List of Unclassifed Manufacturers
|
| MIAR03-05D12 MIAR03-05S12 MIAR03-12S15 MIAR03-05D1 |
DC/DC CONVERTER 3W, DIP-24 Plastic Package Cost optimized Design
|
Minmax Technology Co., Ltd.
|
| HVR100 |
Small Resin Package (SRP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| HVD369B |
Super small Flat Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| HVD350B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| LHUV-0380-0150 LHUV-0380-0200 LHUV-0380-0250 LHUV- |
Superior flux density, efficiency and design freedom ?in the industry’s only micro-package UV LED
|
Lumileds Lighting Compa...
|
| HVD355B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| AEC-6913-A1M-1010 AEC-6913-A2M-1010 |
Design for Industrial Automation, Reliable Design: RS-422/485 10x. DIO
|
AAEON Technology
|
| KTY84 KTY84/151113 |
Silicon temperature sensors; Package: SOD68 (DO-34); Container: Reel pack axial radial SPECIALTY ANALOG CIRCUIT
|
NXP Semiconductors N.V.
|
| ADNB-6002 |
Agilent Optical Mouse Sensors (LED-based Sensors) Selection Guide
|
AVAGO TECHNOLOGIES LIMITED
|
