PART |
Description |
Maker |
KMM5322204C2WG KMM5322204C2W |
2M x 32 DRAM SIMM using 1Mx16 , 1K Refresh, 5V 200万32的DRAM上海药物研究所使用1Mx16,每1000刷新V
|
Samsung Semiconductor Co., Ltd. SAMSUNG[Samsung semiconductor]
|
KMM5362203C2WG KMM5362203C2W |
2M x 36 DRAM SIMM using 1Mx16 and 1Mx4 Quad CAS, 1K Refresh, 5V
|
SAMSUNG[Samsung semiconductor]
|
KM23C32205BSG |
32M-Bit (2Mx16 /1Mx32) CMOS Mask ROM(32M(2Mx16 /1Mx32) CMOS掩膜ROM) 32兆位Mx16 / 1Mx32)的CMOS掩模ROM2兆位Mx16 / 1Mx32)的CMOS掩膜光盘
|
Samsung Semiconductor Co., Ltd.
|
HMD1M32M2EG HMD1M32M2EG-60 HMD1M32M2EG-45 |
4Mbyte(1Mx32) EDO Mode, 1K Refresh, 72Pin SIMM, 5V Design 4MbyteMx32)EDO公司模式,每1000刷新2Pin上海药物研究所V的设
|
Hanbit Electronics Co.,Ltd. Panasonic Industrial Solutions Hanbit Electronics Co., Ltd.
|
AS4C1M16E5 |
5V / 3.3V Edo DRAM, 16M, 1Mx16
|
ALLIANCE
|
EDI416S4030A12SI EDI416S4030A10SI EDI416S4030A |
1Mx16 Bits x 4 Banks Synchronous DRAM
|
WEDC[White Electronic Designs Corporation]
|
KMM5361203C2W |
1M x 36 DRAM SIMM(1M x 36 动RAM模块)
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
KMM5328004CSW |
8MB X 32 DRAM Simm Using 4MB X 16
|
Samsung Semiconductor
|
KMM5328004BSW |
8MBx32 DRAM Simm Using 4MBx16
|
Samsung Semiconductor
|
KMM5328000BSW |
4MBx32 DRAM Simm Using 4MBx16
|
Samsung Semiconductor
|
KMM5322104CKUG KMM5322104CKU |
2M x 32 DRAM SIMM using 2Mx8 , 2K Refresh, 5V
|
Samsung semiconductor
|