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LFX200C-3F900I - The ispXPGA architecture

LFX200C-3F900I_289833.PDF Datasheet

 
Part No. LFX200C-3F900I LFX200C-3F900C LFX1200B-03F900C LFX200B-3F900C LFX200B-3F900I LFX200B-4F900C LFX200B-4F900I LFX200C-4F900C LFX200C-4F900I XPGA LFX1200B-03F900I LFX1200B-04F900C LFX1200B-3F900C LFX1200B-3F900I LFX1200B-4F900C LFX1200B-4F900I LFX1200C-03F900C LFX1200C-03F900I LFX1200C-04F900C LFX1200C-3F900C LFX1200C-3F900I LFX1200C-4F900C LFX1200C-4F900I LFX125B-3F900C LFX125B-3F900I LFX125B-4F900C LFX125B-4F900I LFX125C-3F900C LFX125C-4F900C LFX125C-4F900I LFX500B-3F900C
Description The ispXPGA architecture

File Size 885.04K  /  89 Page  

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LATTICE[Lattice Semiconductor]



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PART Description Maker
XPGA LFX1200B-03F900C LFX200B-3F900C LFX500B-3F900 Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
Circular Connector; No. of Contacts:26; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:16; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:16-26 RoHS Compliant: No
PT 8C 8#16 SKT RECP
Circular Connector; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:8; Connector Shell Size:16; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle; Circular Contact Gender:Pin RoHS Compliant: No
The ispXPGA architecture ispXPGA架构
The ispXPGA architecture 在ispXPGA架构
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
M5LV-512/256-10SAI M5LV-512/256-12SAC M5LV-256/160 EE PLD, 10 ns, PBGA352 BGA-352
EE PLD, 12 ns, PBGA352 BGA-352
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160
EE PLD, 15 ns, PBGA352 BGA-352
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP144
EE PLD, 15 ns, PQFP160 PLASTIC, QFP-160
CONNECTOR ACCESSORY EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP100
EE PLD, 15 ns, PQFP100 TQFP-100
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208
EE PLD, 12 ns, PQFP100 TQFP-100
EE PLD, 12 ns, PBGA256 BGA-256
Lattice Semiconductor, Corp.
LATTICE SEMICONDUCTOR CORP
M5LV-320_192-10AI M5LV-512_104-6AC M5-192_74-15YC IND SHLD 3.3UH 9A RMS SMT
Fifth Generation MACH Architecture EE PLD, 7.5 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 12 ns, PBGA256
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP240
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP144
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP208
10-Bit Broadband Modem Mixed Signal Front End (MxFE®); Package: LFCSP (9x9mm, 7.10 exposed pad); No of Pins: 64; Temperature Range: Industrial EE PLD, 12 ns, PQFP144
12-Bit Broadband Modem Mixed Signal Front End (MxFE®); Package: LFCSP (9x9mm, 7.10 exposed pad); No of Pins: 64; Temperature Range: Commercial EE PLD, 15 ns, PQFP144
12-Bit Broadband Modem Mixed Signal Front End (MxFE®); Package: LFCSP (9x9mm, 7.10 exposed pad); No of Pins: 64; Temperature Range: Industrial EE PLD, 15 ns, PQFP144
Fifth Generation MACH Architecture EE PLD, 6.5 ns, PQFP240
CONNECTOR ACCESSORY EE PLD, 10 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 7.5 ns, PBGA352
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 20 ns, PBGA352
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 10 ns, PBGA352
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP160
Fifth Generation MACH Architecture EE PLD, 12 ns, PQFP240
Fifth Generation MACH Architecture EE PLD, 10 ns, PBGA256
Fifth Generation MACH Architecture EE PLD, 15 ns, PQFP240
Fifth Generation MACH Architecture EE PLD, 6.5 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 20 ns, PQFP208
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP208
CONNECTOR ACCESSORY EE PLD, 12 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 5.5 ns, PQFP100
Fifth Generation MACH Architecture EE PLD, 10 ns, PQFP240
   Fifth Generation MACH Architecture
Lattice Semiconductor, Corp.
Lattice Semiconductor Corporation
CY7C1474BV33-200BGC 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V 1M X 72 ZBT SRAM, 3 ns, PBGA209
Cypress Semiconductor, Corp.
CAT64LC20ZS CAT64LC20ZP CAT64LC20J-TE7 CAT64LC20J- 36-Mbit QDR™-II SRAM 4-Word Burst Architecture
36-Mbit QDR™-II SRAM 2-Word Burst Architecture
9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL™ Architecture
4-Mbit (128K x 36) Pipelined SRAM with NoBL™ Architecture
4-Mbit (128K x 36) Flow-through SRAM with NoBL™ Architecture
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL™ Architecture
SPI Serial EEPROM SPI串行EEPROM
36-Mbit QDR™-II SRAM 2-Word Burst Architecture SPI串行EEPROM
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM SPI串行EEPROM
256K (32K x 8) Static RAM SPI串行EEPROM
Analog Devices, Inc.
Electronic Theatre Controls, Inc.
CY7C1334 7C1334 64Kx32 Flow-Thru SRAM with NoBL Architecture(B>NoBL结构4Kx32流通式 SRAM)
From old datasheet system
64Kx32 Pipelined SRAM with NoBL Architecture
Cypress Semiconductor Corp.
CY7C1518JV18-250BZC CY7C1518JV18-300BZXC 72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 DDR SRAM, 0.45 ns, PBGA165
Cypress Semiconductor, Corp.
CY7C1350 7C1350 128Kx36 Pipelined SRAM with NoBL Architecture(带NoBL结构28Kx36流水线式 SRAM) 128K × 36至流水线与总线延迟静态存储器体系结构(带总线延迟结构28K × 36至流水线式的SRAM
128Kx36 Pipelined SRAM with NoBL Architecture(B>NoBL结构28Kx36流水线式 SRAM)
From old datasheet system
Cypress Semiconductor Corp.
CY7C1315AV18-250BZC CY7C1311AV18 CY7C1311AV18-167B 18-Mb QDR(TM)-II SRAM 4-Word Burst Architecture
18-Mb QDRTM-II SRAM 4-Word Burst Architecture
CYPRESS[Cypress Semiconductor]
CY7C1305AV18 CY7C1305AV18-100BZC CY7C1305AV18-133B 18-Mb Burst of 4 Pipelined SRAM with QDR(TM) Architecture
18-Mb Burst of 4 Pipelined SRAM with QDR⑩ Architecture
Cypress Semiconductor
CY7C1474V33-250BGI CY7C1474V33-250BGXC CY7C1474V33 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL垄芒 Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL?Architecture
Cypress Semiconductor
 
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LFX200C-3F900I Purpose LFX200C-3F900I Gain LFX200C-3F900I Memory LFX200C-3F900I FRE DOUNLODE LFX200C-3F900I microchip
LFX200C-3F900I siliconix LFX200C-3F900I poliester LFX200C-3F900I converter LFX200C-3F900I Marin LFX200C-3F900I Reset
 

 

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