| PART |
Description |
Maker |
| DSP56371 DSP56371D |
high density CMOS device
|
MOTOROLA[Motorola, Inc]
Motorola Inc
|
| DSP56374 DSP56374PB DSP56374PB_D DSP56374UM DSP563 |
high density CMOS device with 3.3 V inputs and outputs
|
MOTOROLA[Motorola, Inc]
|
| DSP56374PB/D DSP56300FM/AD DSP56374UM/D DSPB56374A |
The DSP56374 is a high-density CMOS device with 3.3 V inputs and outputs.
Freescale Semiconductor
|
Freescale Semiconductor, Inc
Freescale Semiconductor...
|
| ATV2500B-15KM/883 ATV2500BL-20KM/883 ATV2500BQL-30 |
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 20 ns, PDIP40
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 30 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 15 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CQCC44
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PQCC44
High-Speed High-Density UV Erasable Programmable Logic Device UV PLD, 25 ns, CDIP40
High-Speed High-Density UV Erasable Programmable Logic Device OT PLD, 25 ns, PDIP40
ER 4C 4#8 SKT RECP BOX
Seals
Circular Connector; MIL SPEC:MIL-C-5015 E/F/R; Body Material:Aluminum Alloy; Series:MS3102; No. of Contacts:14; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle; Gender:Female RoHS Compliant: No
Circular Connector; No. of Contacts:14; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:22-19 RoHS Compliant: No
ER 14C 14#16 SKT RECP
CONTROL KNOB RoHS Compliant: Yes
ER 3C 3#8 SKT RECP BOX
ER 7C 7#16 PIN RECP
ER 3C 1#16 2#8 PIN RECP BOX
ER 9C 9#16 PIN RECP
|
Atmel, Corp.
Atmel Corp.
http://
ATMEL Corporation
|
| IDT72V295 IDT72V2105 IDT72V2105L10PF IDT72V2105L15 |
128K x 18 SuperSync FIFO, 3.3V
3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO 131,072 x 18 262,144 x 18
3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO?
|
IDT[Integrated Device Technology]
|
| ISPLSI2128VE ISPLSI2128VE-100LB100 ISPLSI2128VE-10 |
3.3V In-System Programmable SuperFAST?High Density PLD
CRYSTAL 32.768KHZ 12.5PF SMD
3.3V In-System Programmable SuperFAST?/a> High Density PLD
3.3V In-System Programmable SuperFAST⑩ High Density PLD
3.3V In-System Programmable SuperFAST High Density PLD
CRYSTAL 12.0 MHZ 20PF SMD
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 7.5 ns, PQFP176
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 7.5 ns, PBGA208
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 6 ns, PBGA208
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 10 ns, PBGA100
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 7.5 ns, PBGA100
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 7.5 ns, PQFP160
3.3V In-System Programmable SuperFASTHigh Density PLD EE PLD, 7.5 ns, PQFP100
3.3V In-System Programmable SuperFASTHigh Density PLD 3.3在系统可编程超快⑩高密度可编程逻辑器件
3.3VIn-SystemProgrammableSuperFASTHighDensityPLD
3.3V In-System Programmable SuperFAST?/a> High Density PLD
|
LATTICE[Lattice Semiconductor]
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
|
| XCF128XFTG64C DS617 XCF32PV0G48C |
Platform Flash XL High-Density Configuration and Storage Device 8M X 16 FLASH 1.8V PROM, 85 ns, PBGA64
Platform Flash XL High-Density Configuration
|
Xilinx, Inc.
|
| MACH110-12JC MACH110-15JC MACH110-20JC MACH110-12 |
High-Density EE CMOS Programmable Logic
|
LATTICE[Lattice Semiconductor]
|
| CLA90000 |
High Density CMOS Gate Arrays
|
Zarlink Semiconductor
|
| CBRLDSH2-40 CBRLDSH2-40-15 |
SURFACE MOUNT HIGH DENSITY HIGH DENSITY SCHOTTKY BRIDGE RECTIFIER
|
Central Semiconductor C...
|
| MACH220-20JC |
High-Density EE CMOS Programmable Logic EE PLD, 20 ns, PQCC68
|
Lattice Semiconductor Corporation
Lattice Semiconductor, Corp.
|
| IDT72V211110PFI IDT72V2111L15PF |
3.3 VOLT HIGH DENSITY CMOS SUPERSYNC FIFO 3.3伏高密度CMOS SUPERSYNC先进先出
|
Integrated Device Technology, Inc.
|
