| PART |
Description |
Maker |
| KTD2005 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| BL817S |
High Density Mounting Type Photocoupler
|
SeCoS Halbleitertechnologie GmbH
|
| PC818 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Components
|
| LTV817 LTV817M |
High Density Mounting Type Photocoupler(484.19 k)
|
LITE-ON
|
| HPCL-817 HPCL817 |
Phototransistor Optocoupler High Density Mounting Type
|
Agilent Technologies
|
| PC861 |
High Collector-emitter Voltage/ High Density Mounting Type Photocoupler
High Collector-emitter Voltage High Density Mounting Type Photocoupler
High Collector-emitter Voltage, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| LTV829 LTV-819 LTV819 |
(LTV-819 Series) High Density Mounting Type Photocoupler
|
LITE-ON Electronics
|
| IS452 |
HIGH DENSITY MOUNTING HIGH VOLTAGE DARLINGTON OPTICALLY COUPLED ISOLATORS
|
List of Unclassifed Manufacturers
ISOCOM
|
| HSM88AS |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
光宝科技股份有限公司
|
| TIL199 TIL199A TIL199B TIL198A TIL198B |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
