| PART |
Description |
Maker |
| XC3020 XC3064 XC3042L XC3064L XC3030 XC3100 XC3090 |
XC3000 Logic Cell Array Families
|
http://
Xilinx, Inc.
|
| KA7307D |
GENERAL DESCRIPTION
|
Samsung semiconductor
|
| I709X |
General Description
|
Taiwan Memory Technolog...
|
| ANTDB1HDPXXX |
Product Description
|
List of Unclassifed Man...
|
| HT3400 |
GENERAL DESCRIPTION
|
TY Semiconductor Co., Ltd
TY Semiconductor Co., L...
|
| BT132 |
TRANSISTOR
GENERAL DESCRIPTION
|
TY Semicondutor
TY Semiconductor Co., Ltd
|
| AN2725 |
a brief description of the TS2012 device
|
STMicroelectronics
|
| AN4208 |
package description and recommendations for use
|
STMicroelectronics
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| AOWF11N60 AOWF11N60L |
TO362F PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AON7532E |
DFN3X3 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
