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  90130-1210 Datasheet PDF File

For 90130-1210 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    90130-1210 0901301210

Molex Electronics Ltd.
Part No. 90130-1210 0901301210
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-3218

Molex Electronics Ltd.
Part No. 90130-3218
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-3306

Molex Electronics Ltd.
Part No. 90130-3306
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-3108

Molex Electronics Ltd.
Part No. 90130-3108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    90130-3106

Molex Electronics Ltd.
Part No. 90130-3106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    90130-3210

Molex Electronics Ltd.
Part No. 90130-3210
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 10 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    90130-3216

Molex Electronics Ltd.
Part No. 90130-3216
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021121-00008C8LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 8Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    90130-3214

Molex Electronics Ltd.
Part No. 90130-3214
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-103260950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-3212

Molex Electronics Ltd.
Part No. 90130-3212
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021121-00006C4LF
Description Minitek127®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 6Positions, 1.27mm (0.5inch) pitch.
Tech specs    

Official Product Page

    90130-3308

Molex Electronics Ltd.
Part No. 90130-3308
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-108241200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 90130-1210 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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