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  01301 Datasheet PDF File

For 01301 Found Datasheets File :: 83+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 |   

    90130-1268 0901301268

Molex Electronics Ltd.
Part No. 90130-1268 0901301268
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 578.23K  /  7 Page

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Texas Instruments

Part No. 8601301EA
Description 4-Bit Magnitude Comparator 16-CDIP -55 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-1254 0901301254

Molex Electronics Ltd.
Part No. 90130-1254 0901301254
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 585.60K  /  7 Page

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Texas Instruments

Part No. 7601301EA
Description Dual J-K Flip-Flops With Preset And Clear 16-CDIP -55 to 125
Tech specs    

Official Product Page

    90130-1244 0901301244

Molex Electronics Ltd.
Part No. 90130-1244 0901301244
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.22K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-017LF
Description Berg Duflex Housing, single row, 17 Position.
Tech specs    

Official Product Page

    90130-1206 0901301206

Molex Electronics Ltd.
Part No. 90130-1206 0901301206
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-018LF
Description Berg Duflex Housing, single row, 18 Position.
Tech specs    

Official Product Page

    90130-1238 0901301238

Molex Electronics Ltd.
Part No. 90130-1238 0901301238
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. ME1013010182011
Description MINICOOLEDGE130P,Vertical,0.6MM,SMT
Tech specs    

Official Product Page

    90130-1234 0901301234

Molex Electronics Ltd.
Part No. 90130-1234 0901301234
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 75970-130-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row,10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1230 0901301230

Molex Electronics Ltd.
Part No. 90130-1230 0901301230
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 1,141.29K  /  12 Page

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Amphenol Communications Solutions

Part No. 10120300-130-102LF
Description Receptacle, 4 Pair, 15 Column, 9mm Height, 85Ω, Without Damper, Lead Free
Tech specs    

Official Product Page

    90130-1226 0901301226

Molex Electronics Ltd.
Part No. 90130-1226 0901301226
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 10130186-G01ALF
Description Unshrouded Right angle Header, Surface Mount, Single Row, Polarized, 15 Position , 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    90130-1224 0901301224

Molex Electronics Ltd.
Part No. 90130-1224 0901301224
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-016LF
Description Berg Duflex Housing, single row, 16 Position.
Tech specs    

Official Product Page

    90130-1222 0901301222

Molex Electronics Ltd.
Part No. 90130-1222 0901301222
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 67013-015LF
Description Berg Duflex Housing, single row, 15 Position.
Tech specs    

Official Product Page

For 01301 Found Datasheets File :: 83+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 |   

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