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wedge Datasheet PDF File

For wedge Found Datasheets File :: 956 Search Time::1.89ms
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				Hittite Microwave Corporation
Part No.	HMC1081
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams ...
Description	GaAs MMIC MIXER 50 - 75 GHz
File Size	382.34K / 8 Page	View it Online	Download Datasheet

				RF Micro Devices, Inc. RFMD[RF Micro Devices] http://
Part No.	NBB-402 NBB-402-T3 NBB-X-K1 NBB-402-E NBB-402-T1
OCR Text	...made through wire bonds. Either wedge or ball bonding methods are acceptable practices for wire bonding. Assembly Procedure Epoxy or eutectic die attach are both acceptable attachment methods. Top and bottom metallization are gold. Conducti...
Description	Cascadable Broadband GaAs MMIC Amplifier DC to 8 GHz CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 8GHz From old datasheet system
File Size	211.19K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC48609
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams...
Description	GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 7 - 9 GHz
File Size	262.57K / 8 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TQM7M5022 TQM7M5022-15
OCR Text	... appli cations ? gsm/edge/wedge handsets ? gsm/edge/wedge wireless cards package style top view package size: lga 5 x 5 x 1 mm 850 band 900 band dcs band pcs band units typ typ typ typ gsm pout 35 35 33 33 dbm...
Description	3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module 3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module
File Size	54.00K / 1 Page	View it Online	Download Datasheet

				Skyworks Solutions Inc.
Part No.	DSM8100-000
OCR Text	...sed. Also available is a heated wedge shank which is held by the weld head and in turn holds the tip and supplies heat to it. The wedge shank is heated by means of a simple AC power supply or a pulse type heated tool. Substrate For optimum ...
Description	Mesa Beam Lead PIN Diode
File Size	59.37K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55309
OCR Text	... schedule. wire bonding ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of...
Description	GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz
File Size	215.97K / 6 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TQM7M5012H TQM7M5012H-15
OCR Text	... applications ? gsm/edge/wedge handsets ? gsm/edge/wedge wireless cards package style top view package size: lga 5 x 5 x 1 mm 850 band 900 band dcs band pcs band units typ typ typ typ gsm pou t 35 34.7 33 32.7 dbm...
Description	3V Quad-Band GSM850/GSM900/DCS/PCS Power Amplifier Module
File Size	96.14K / 1 Page	View it Online	Download Datasheet

				RF Micro Devices, Inc.
Part No.	NBB-302-T3
OCR Text	...made through wire bonds. either wedge or ball bonding methods are acceptable practices for wire bonding. assembly procedure epoxy or eutectic die attach are both accept able attachment me thods. top and bo ttom metallization are gold. cond...
Description	Amplifier. Other 放大器。其
File Size	101.38K / 8 Page	View it Online	Download Datasheet

				CML[Chicago Miniature Lamp,inc]
Part No.	CM3950 CM6502 CM8847 CM1103 CM1104 CM1107 CM1108 CM1111 CM1730 CM1738 CM1783 CM1784 CM2119 CM2129 CM2156 CM2158 CM2169 CM2171 CM2184 CM2191 CM2200 CM2203 CM2264 CM286 CM3105 CM3110 CM3151 CM3626 CM3627 CM3628 CM6515 CM6516 CM6521 CM6522 CM8664 CM8784 CM8805 CM1728
OCR Text	wedge Base .197 MAX . P art Number C M6502 C M1103 C M1104 C M3105 C M6516 C M6521 C M6522 C M6515 C M1107 C M1108 C M286 C M1111 C M3110 Des ign V oltage 4.0 6.0 6.0 6.0 6.0 6.0 6.0 7.0 12.0 12.0 13.5 24.0 24.0 A mps .250 .030 .0...
Description	T-1 1/2 wedge BASE
File Size	218.53K / 1 Page	View it Online	Download Datasheet

				Filtronic Compound Semiconductors
Part No.	FMS2020
OCR Text	...e raised above 60g. Thermosonic wedge bonding and thermocompression wedge bonding can also be used to achieve good wire bonds. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the...
Description	GAAS MULTI-PURPOSE WIDE BAND SPDT SWITCH
File Size	212.44K / 4 Page	View it Online	Download Datasheet

For wedge Found Datasheets File :: 956 Search Time::1.89ms
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