| |
|
 |
Molex Electronics Ltd.
|
| Part No. |
0879253000 87925-3000
|
| Description |
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus Pa-S Receptacle, Press-fit, Vertical, 0.76μm (30μ) Gold (Au)Plating, 33 Circuits
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus?Pa-S Receptacle, Press-fit, Vertical, 0.76μm (30μ) Gold (Au)Plating, 33 Circuits
|
| File Size |
187.24K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
7MPV6253-000
|
| Description |
SRAM MODULE
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0353000450 35300-0450 353000450
|
| Description |
2.50mm (.098) Pitch Wire-to-Board KK? Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 4 Circuits, Tin (Sn) Plating
2.50mm (.098") Pitch Wire-to-Board KK庐 Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 4 Circuits, Tin (Sn) Plating
MOLEX Connector
|
| File Size |
180.35K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA14530-00FXDB-P
|
| Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA14530-00FXDEVKT-P
|
| Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Renesas Electronics Corporation |
| Part No. |
DA14530-00000FX2
|
| Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
55530-001
|
| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, Polarized, 44 Positions ,2.00mm (0.079in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Molex Electronics Ltd.
|
| Part No. |
0353000550 353000550 35300-0550
|
| Description |
2.50mm (.098) Pitch Wire-to-Board KK? Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 5 Circuits, Tin (Sn) Plating
2.50mm (.098") Pitch Wire-to-Board KK垄莽 Header, Vertical, with Friction Ramp, TubePackaged Version of 5045, 5 Circuits, Tin (Sn) Plating
MOLEX Connector
|
| File Size |
180.35K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
FLSC80353000
|
| Description |
DOME COVER 80 mm DIA, 35 mm high, FLS Series - RED
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
10119109-530007LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
FLSC80753000
|
| Description |
DOME COVER 80 mm DIA, 75 mm high, FLS Series - RED
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
48253-000LF
|
| Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
84530-002
|
| Description |
200 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
