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  preheating Datasheet PDF File

For preheating Found Datasheets File :: 3410    Search Time::1.734ms    
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    CGY2032TS

NXP Semiconductors
Philips Semiconductors
Part No. CGY2032TS
OCR Text ...or type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should pr...
Description DECT 500 mW power amplifier

File Size 60.20K  /  12 Page

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    CGY2105 CGY2105ATS

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. CGY2105 CGY2105ATS
OCR Text ...or type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should pr...
Description High dynamic range dual LNA MMIC

File Size 83.75K  /  16 Page

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    CGY2106TS CGY2106TS/C1

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. CGY2106TS CGY2106TS/C1
OCR Text ...or type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should pr...
Description CGY2106TS; High dynamic range dual LNA MMIC

File Size 88.56K  /  16 Page

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    MAX1755 MAX1755AAUT-T MAX1755BAUT-T MAX1755-MAX1756 MAX1756AAUT-T MAX1756BAUT-T

Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
Part No. MAX1755 MAX1755AAUT-T MAX1755BAUT-T MAX1755-MAX1756 MAX1756AAUT-T MAX1756BAUT-T
OCR Text ...r IR/VPR and Convection reflow. preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and funct...
Description SOT23 Local Temperature Comparators with SMBus Serial Interface

File Size 290.36K  /  11 Page

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    MAX2205 MAX2205EBS MAX2205-MAX2208 MAX2206EBS MAX2207EBS MAX2208EBS MAX2208

Maxim Integrated Products, Inc.
MAXIM[Maxim Integrated Products]
MAXIM - Dallas Semiconductor
Part No. MAX2205 MAX2205EBS MAX2205-MAX2208 MAX2206EBS MAX2207EBS MAX2208EBS MAX2208
OCR Text ...r IR/VPR and convection reflow. preheating is required. Hand or wave soldering is not allowed. Note 2: Specifications over TA = -40C to +85C are guaranteed by design. Production tests are performed at TA = +25C. Note 3: Response time is tak...
Description 射频功率检波器的UCSP封装
Quadruple Bus Buffer Gates With 3-State Outputs 14-TSSOP -40 to 85
Quadruple Bus Buffer Gates With 3-State Outputs 14-SO -40 to 85
RF Power Detectors in UCSP

File Size 167.63K  /  7 Page

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    MMBT6517LT1 MMBT6517LT1_D ON2130

MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
ON Semi
Part No. MMBT6517LT1 MMBT6517LT1_D ON2130
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description From old datasheet system
Motorola Preferred Device
High Voltage Transistor

File Size 229.86K  /  8 Page

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    PZT651T1 ON2780 PZT65

ONSEMI[ON Semiconductor]
Part No. PZT651T1 ON2780 PZT65
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description From old datasheet system
HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT

File Size 101.17K  /  6 Page

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    MBRV7030CTL MBRV7030CTL_D ON0481

Motorola, Inc.
ON Semi
MOTOROLA[Motorola, Inc]
Part No. MBRV7030CTL MBRV7030CTL_D ON0481
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description TOOLS, ELECTRONIC KITS RoHS Compliant: NA
SWIRCHMODE Schottky Power Rectifier(D3PAK Power Surface Mount Pakage)
70 AMPERES 30 VOLTS
From old datasheet system
SWIRCHMODE⑩ Schottky Power Rectifier(D3PAK Power Surface Mount Pakage)

File Size 154.71K  /  8 Page

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    UBA1710M

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. UBA1710M
OCR Text ...atures range from 215 to 250 C. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the li...
Description Modulator for GaAs power amplifiers

File Size 58.92K  /  12 Page

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    UBA2000T

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. UBA2000T
OCR Text ...rters. The circuit controls the preheating and ignition of the lamp. The preheat time is well defined without spread, since it is derived from the mains frequency. When the lamp fails, ignition is shut-off after 7 ignition attempts. The cir...
Description Electronic TL-lamp starter(电子TL-lamp启动

File Size 102.83K  /  16 Page

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For preheating Found Datasheets File :: 3410    Search Time::1.734ms    
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